3D IC Solutions Engineer - Package Design Engineer - EDA
Siemens
3D IC Solutions Engineer - Package Design Engineer - EDA
Job Description
Siemens EDA is a global technology leader in Electronic Design Automation products and systems. Our portfolio enables companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our solutions to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board and system design.
Siemens EDA is seeking a senior level, self-starting, motivated, and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design/verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.
Responsibilities
The primary responsibility for this position will be to drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs. These workflows include package floor planning, package/chiplet level functional/ IO planning, interposer/substrate planning, layout, package level connectivity, Logical Equivalence Checking (LEC), package level 3D stack (DRC/LVS) verification and physical DRC/DFM verification of the package components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D IC workflows into the 3D IC Physical Design workflow.
Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The package design lead will also provide technical support and guidance to the sales, marketing design service organizations as required.
This position may require periodic travel to work with customers in developing and validating these workflow solutions.
Requirements
- BS or MS in Electrical/Computer Engineering - or equivalent
- Advanced package physical design and verification experience
- Working knowledge (experience preferred) of Advanced Packaging IC EDA tools and design methods including:
- 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
- Package Design Cadence (APD/SiP), Siemens (XSI/XPD)
- Signal/Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave), Cadence (Sigrity,Clarity)
- Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
- Working knowledge of IC EDA tools and design methods including:
- ASIC design methodology from RTL Synthesis to Physical Implementation phases
- RTL Design/Verification, LEC, STA analysis
- Integration and validation of Silicon-on-Chip IP integration and validation
- Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
- Physical Verification: DRC, LVS, IR/EM analysis
- DFT integration and ATE test support.
- Working knowledge of Thermal/Stress analysis and/or optical design tools and design methods a plus, including:
- Thermal and/or mechanical stress analysis tools:Siemens (NX, Flowtherm,SimCenter 3D), Ansys (Icepak, Mechanical), Cadence (Celsius)
- Optical design/analysis tools:Siemens (Tanner), Ansys (Lumerical)
- Working competency with Microsoft Word, Excel, and PowerPoint.
Working at Siemens Software
Why us?
Working at Siemens Software means flexibility – choosing between working at home or in the office is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.
Siemens Industry Software is an equal opportunities employer and does not discriminate unlawfully on the grounds of age, disability, gender assignment, marriage, and civil partnership, pregnancy and parental, race, religion or belief, sex, sexual orientation, or trade union membership.
#LI-JR1
#LI-EDA
#LI-HYBRID
Locations
- Munich, Bayern, Germany
Salary
Estimated Salary Rangemedium confidence
85,000 - 150,000 EUR / yearly
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- Advanced package physical design and verificationintermediate
- Advanced Packaging IC EDA tools (2.5D/3D solutions, Si Interposer, FOWLP, Organic Package)intermediate
- Package Design tools (Cadence APD/SiP, Siemens XSI/XPD)intermediate
- Signal/Power integrity analysis (Siemens HyperLynx SI/PI, Ansys Redhawk, Totem, Swave)intermediate
Required Qualifications
- BS or MS in Electrical/Computer Engineering or equivalent (experience)
Responsibilities
- Drive development of workflows for 3D IC physical design planning, layout, and verification
- Package floor planning, chiplet level functional/IO planning, interposer/substrate planning
- Layout, package level connectivity, LEC, 3D stack DRC/LVS verification
- Physical DRC/DFM verification
- Integrate other 3D IC workflows
- Provide technical support to sales, marketing, design services
- Travel to work with customers
Answer 10 quick questions to check your fit for 3D IC Solutions Engineer - Package Design Engineer - EDA @ Siemens.
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3D IC Solutions Engineer - Package Design Engineer - EDA
Siemens
3D IC Solutions Engineer - Package Design Engineer - EDA
Job Description
Siemens EDA is a global technology leader in Electronic Design Automation products and systems. Our portfolio enables companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our solutions to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board and system design.
Siemens EDA is seeking a senior level, self-starting, motivated, and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design/verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.
Responsibilities
The primary responsibility for this position will be to drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs. These workflows include package floor planning, package/chiplet level functional/ IO planning, interposer/substrate planning, layout, package level connectivity, Logical Equivalence Checking (LEC), package level 3D stack (DRC/LVS) verification and physical DRC/DFM verification of the package components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D IC workflows into the 3D IC Physical Design workflow.
Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The package design lead will also provide technical support and guidance to the sales, marketing design service organizations as required.
This position may require periodic travel to work with customers in developing and validating these workflow solutions.
Requirements
- BS or MS in Electrical/Computer Engineering - or equivalent
- Advanced package physical design and verification experience
- Working knowledge (experience preferred) of Advanced Packaging IC EDA tools and design methods including:
- 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
- Package Design Cadence (APD/SiP), Siemens (XSI/XPD)
- Signal/Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave), Cadence (Sigrity,Clarity)
- Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
- Working OS knowledge of Windows and Linux
- Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
- Working knowledge of IC EDA tools and design methods including:
- ASIC design methodology from RTL Synthesis to Physical Implementation phases
- RTL Design/Verification, LEC, STA analysis
- Integration and validation of Silicon-on-Chip IP integration and validation
- Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
- Physical Verification: DRC, LVS, IR/EM analysis
- DFT integration and ATE test support.
- Working knowledge of Thermal/Stress analysis and/or optical design tools and design methods a plus, including:
- Thermal and/or mechanical stress analysis tools:Siemens (NX, Flowtherm,SimCenter 3D), Ansys (Icepak, Mechanical), Cadence (Celsius)
- Optical design/analysis tools:Siemens (Tanner), Ansys (Lumerical)
- Working competency with Microsoft Word, Excel, and PowerPoint.
Working at Siemens Software
Why us?
Working at Siemens Software means flexibility – choosing between working at home or in the office is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.
Siemens Industry Software is an equal opportunities employer and does not discriminate unlawfully on the grounds of age, disability, gender assignment, marriage, and civil partnership, pregnancy and parental, race, religion or belief, sex, sexual orientation, or trade union membership.
#LI-JR1
#LI-EDA
#LI-HYBRID
Locations
- Munich, Bayern, Germany
Salary
Estimated Salary Rangemedium confidence
85,000 - 150,000 EUR / yearly
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- Advanced package physical design and verificationintermediate
- Advanced Packaging IC EDA tools (2.5D/3D solutions, Si Interposer, FOWLP, Organic Package)intermediate
- Package Design tools (Cadence APD/SiP, Siemens XSI/XPD)intermediate
- Signal/Power integrity analysis (Siemens HyperLynx SI/PI, Ansys Redhawk, Totem, Swave)intermediate
Required Qualifications
- BS or MS in Electrical/Computer Engineering or equivalent (experience)
Responsibilities
- Drive development of workflows for 3D IC physical design planning, layout, and verification
- Package floor planning, chiplet level functional/IO planning, interposer/substrate planning
- Layout, package level connectivity, LEC, 3D stack DRC/LVS verification
- Physical DRC/DFM verification
- Integrate other 3D IC workflows
- Provide technical support to sales, marketing, design services
- Travel to work with customers
Answer 10 quick questions to check your fit for 3D IC Solutions Engineer - Package Design Engineer - EDA @ Siemens.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs