WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are seeking an experienced and motivated candidate to drive our EDA (Electronic Design Automation) roadmap and provide technical leadership for our Package CAD team. In this role, you will be responsible for developing, enhancing, and maintaining best-in-class package design flows to enable cutting-edge packaging solutions. THE PERSON: The ideal candidate is a collaborative and proactive problem solver who thrives in cross-functional environments. They are comfortable engaging with internal subject matter experts and external EDA vendors to drive continuous improvement in design methodologies. With a strong ability to synthesize complex industry practices into streamlined, software-driven workflows, they ensure consistency, efficiency, and usability across diverse projects. Clear communication, adaptability, and a commitment to innovation are key traits that enable them to influence and enhance the broader design ecosystem. KEY RESPONSIBILITIES: Lead the development, deployment, and support of digital design tool flows for advanced packaging architectures, including 2.5D and 3D designs. Drive the EDA roadmap in alignment with business and technology goals. Act as the primary technical liaison with EDA vendors to troubleshoot, resolve tool issues, and influence future tool capabilities. Partner with internal teams to identify process gaps, gather feedback, and incorporate improvement opportunities into the design flow. Promote innovation by integrating new methodologies and best practices into the CAD environment. PREFERRED EXPERIENCE: Deep understanding of advanced packaging technologies. Strong background in Electronic Design Automation (EDA) tools and methodologies, including 3DIC Compiler. Familiarity with EDA vendor collaboration, including tool evaluation, issue resolution, and roadmap influence. Layout experience in Cadence or Expedition. Substrate design experience. Programming in Python and Tcl. Familiarity with Interposer and Passive Bridge design. ACADEMIC CREDENTIALS: Bachelor's or Master's in Electrical Engineering, Computer Engineering, Computer Science or similar. LOCATION: Austin, TX #LI-BS1 #LI-Hybrid Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.