Job Description

Locations

• China, 31, Shanghai, Shanghai, 31, People's Republic of China
• China, 44, Shenzhen, Shenzhen, 44, People's Republic of China

Salary

Skills Required

• - MSEE with at least 7+ years of experience or BSEE with at least 10+ years of experience in consumer product designintermediate
• - At least 4+ years of experience of leading and working with ODM/OEMs for all stages of product developmentintermediate
• - At least 7+ years of experience with system-level design including circuit design, system bring-up, integration, and debugintermediate
• - Knowledge of low-power circuit design, DC/DC converters, power management methods, audio circuit design, and analog designintermediate
• - Knowledge of processor architecture, digital circuit design, high speed signal design and debug (especially on discrete DDR) and various communications protocols such as I2C, UART, SPI, USB, MIPI, I2S, etc.intermediate
• - Knowledge of mixed-signal board-level designintermediate
• - Experience developing robust designs for ESD/EMI immunities and RF de-sensitizationintermediate
• - Experience integrating RF technologies such as WIFI, BT, GPS, etc.intermediate
• - Experience leading and driving design development from schematic capture, PCB layout through assemblyintermediate
• - Experience partnering with software teams to define and implement firmware, drivers and algorithmsintermediate

Required Qualifications

• - MSEE with at least 7+ years of experience or BSEE with at least 10+ years of experience in consumer product design (experience, 7 years)
• - At least 4+ years of experience of leading and working with ODM/OEMs for all stages of product development (experience, 4 years)
• - At least 7+ years of experience with system-level design including circuit design, system bring-up, integration, and debug (experience, 7 years)
• - Knowledge of low-power circuit design, DC/DC converters, power management methods, audio circuit design, and analog design (experience)
• - Knowledge of processor architecture, digital circuit design, high speed signal design and debug (especially on discrete DDR) and various communications protocols such as I2C, UART, SPI, USB, MIPI, I2S, etc. (experience)
• - Knowledge of mixed-signal board-level design (experience)
• - Experience developing robust designs for ESD/EMI immunities and RF de-sensitization (experience)
• - Experience integrating RF technologies such as WIFI, BT, GPS, etc. (experience)
• - Experience leading and driving design development from schematic capture, PCB layout through assembly (experience)
• - Experience partnering with software teams to define and implement firmware, drivers and algorithms (experience)
• - English and Mandarin language skills (experience)
• - 30% - 50% travel required (experience)

Preferred Qualifications

• - Strong interpersonal skills and capability to manage and drive various cross-functional team members (experience)
• - Understanding of high speed design and noise suppression techniques (experience)
• - Hands on experience with signal integrity tools (experience)
• - Experience in designing products for wireless networks (GSM, UMTS, LTE), GPS, WiFi, and Bluetooth wireless systems (experience)
• - Strong communication and documentation skills and ability to operate autonomously (experience)
• - Complete understanding of manufacturing process including DFM and DFT for consumer products (experience)

Responsibilities

• In your lead role you will be the owner of all aspects of EE hardware design including, circuit/board design and validation. As part of a system team, you will work alongside system integrator and technology focused engineers who are subject matter experts of their fields. You will be responsible for integrating various core features of the product such as mics, speakers, display, cameras, and sensors, improving overall system quality, working with software/product design engineers to optimize product performance, and debugging complex systemic problems. You will be involved in projects from concept through production, gaining exposure to the complete design lifecycle. You will also support engineering builds gaining experience with high volume manufacturing.

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