IC Package Integration Engineer
Apple
IC Package Integration Engineer
Job Description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. - Work with cross-functional teams and lead package integration and architecture efforts. - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs ~10% International travel. - Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- love for excellenceintermediate
- passionintermediate
- dedicationintermediate
- hardworkingintermediate
- cross-functional team collaborationintermediate
- leadershipintermediate
- package integrationintermediate
- package architectureintermediate
- working with 3rd party vendorsintermediate
- working with OSATintermediate
- packaging solution developmentintermediate
- concept to HVMintermediate
- driving industry standardsintermediate
- advanced package solutionsintermediate
- innovative packaging solutionsintermediate
- mass productionintermediate
- package developmentintermediate
- module developmentintermediate
- technology developmentintermediate
- international travel willingnessintermediate
Required Qualifications
- BS and +10 years of relevant industry experience (experience, 10 years)
Preferred Qualifications
- We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development (experience)
- Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA (experience)
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints (experience)
- Excellent problem solving with strong physics and fundamentals (experience)
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers (experience)
- Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost (experience)
- Ability to work independently and take on projects with minimum supervision (experience)
- Ability to lead and manage teams (experience)
- Knowledge of Cellular packaging and systems a plus (experience)
Responsibilities
- - Work with cross-functional teams and lead package integration and architecture efforts.
- - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs ~10% International travel.
- - Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
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Answer 10 quick questions to check your fit for IC Package Integration Engineer @ Apple.
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IC Package Integration Engineer
Apple
IC Package Integration Engineer
Job Description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team. - Work with cross-functional teams and lead package integration and architecture efforts. - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs ~10% International travel. - Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- love for excellenceintermediate
- passionintermediate
- dedicationintermediate
- hardworkingintermediate
- cross-functional team collaborationintermediate
- leadershipintermediate
- package integrationintermediate
- package architectureintermediate
- working with 3rd party vendorsintermediate
- working with OSATintermediate
- packaging solution developmentintermediate
- concept to HVMintermediate
- driving industry standardsintermediate
- advanced package solutionsintermediate
- innovative packaging solutionsintermediate
- mass productionintermediate
- package developmentintermediate
- module developmentintermediate
- technology developmentintermediate
- international travel willingnessintermediate
Required Qualifications
- BS and +10 years of relevant industry experience (experience, 10 years)
Preferred Qualifications
- We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development (experience)
- Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA (experience)
- Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints (experience)
- Excellent problem solving with strong physics and fundamentals (experience)
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers (experience)
- Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost (experience)
- Ability to work independently and take on projects with minimum supervision (experience)
- Ability to lead and manage teams (experience)
- Knowledge of Cellular packaging and systems a plus (experience)
Responsibilities
- - Work with cross-functional teams and lead package integration and architecture efforts.
- - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs ~10% International travel.
- - Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
Tags & Categories
Answer 10 quick questions to check your fit for IC Package Integration Engineer @ Apple.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs