IC Packaging Integration Engineer
Apple
IC Packaging Integration Engineer
Job Description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 60,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- love for excellenceintermediate
- passionintermediate
- dedicationintermediate
- IC packaging developmentintermediate
- working with cross-functional teamsintermediate
- leading SoC Package integrationintermediate
- leading architecture effortsintermediate
- driving advanced package solutionsintermediate
- new material developmentsintermediate
- specs developmentintermediate
Required Qualifications
- BS and 10+ years of experience in relevant industry experience (experience, 10 years)
Preferred Qualifications
- MS/PhD and 6+ years of experience in relevant industry. (experience, 6 years)
- We are looking for someone experienced in the semiconductor packaging and/or system integration. (experience)
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration. (experience)
- Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. (experience)
- Excellent problem solving with strong physics and fundamentals. (experience)
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. (experience)
- Basic knowledge of signal integrity/power integrity. (experience)
- Ability to review schematics, package/PCB layout and designs in Allegro. (experience)
Responsibilities
- • You will be responsible for IC packaging development
- • Work with cross-functional teams and lead SoC Package integration and architecture efforts
- • Drive the industry with advanced package solutions, new material developments, and specs
- Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
- Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, CoWoS, coreless MCM).
- Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
- Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
- Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.
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Answer 10 quick questions to check your fit for IC Packaging Integration Engineer @ Apple.
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IC Packaging Integration Engineer
Apple
IC Packaging Integration Engineer
Job Description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team! • You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 60,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- love for excellenceintermediate
- passionintermediate
- dedicationintermediate
- IC packaging developmentintermediate
- working with cross-functional teamsintermediate
- leading SoC Package integrationintermediate
- leading architecture effortsintermediate
- driving advanced package solutionsintermediate
- new material developmentsintermediate
- specs developmentintermediate
Required Qualifications
- BS and 10+ years of experience in relevant industry experience (experience, 10 years)
Preferred Qualifications
- MS/PhD and 6+ years of experience in relevant industry. (experience, 6 years)
- We are looking for someone experienced in the semiconductor packaging and/or system integration. (experience)
- Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration. (experience)
- Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints. (experience)
- Excellent problem solving with strong physics and fundamentals. (experience)
- Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers. (experience)
- Basic knowledge of signal integrity/power integrity. (experience)
- Ability to review schematics, package/PCB layout and designs in Allegro. (experience)
Responsibilities
- • You will be responsible for IC packaging development
- • Work with cross-functional teams and lead SoC Package integration and architecture efforts
- • Drive the industry with advanced package solutions, new material developments, and specs
- Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
- Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, CoWoS, coreless MCM).
- Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
- Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
- Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.
Tags & Categories
Answer 10 quick questions to check your fit for IC Packaging Integration Engineer @ Apple.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs