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IC Packaging Simulation Engineer

Apple

Engineering Jobs

IC Packaging Simulation Engineer

full-timePosted: Oct 20, 2025

Job Description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization. • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. • You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.

Locations

  • Santa Clara, California, United States 95050

Salary

Estimated Salary Rangemedium confidence

25,000,000 - 45,000,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • attention to detailintermediate
  • proficiency in FEM simulationintermediate
  • proficiency in ANSYSintermediate
  • proficiency in ABAQUSintermediate
  • familiarity with simulation development processintermediate
  • familiarity with characterization projectsintermediate
  • collaboration skillsintermediate
  • stress simulationintermediate
  • deformation simulationintermediate
  • IC package simulationintermediate
  • chip-package interaction analysisintermediate
  • package-board interaction analysisintermediate
  • scripting CAD/FEM softwareintermediate
  • Generative AIintermediate
  • Machine Learningintermediate
  • numerical toolsintermediate
  • automated model-generationintermediate
  • user interface developmentintermediate

Required Qualifications

  • BS and 3+ years of relevant industry experience. (experience, 3 years)

Preferred Qualifications

  • Proven capability in mechanics and mathematics. (experience)
  • Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). (experience)
  • Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python. (experience)
  • Hands-on experience of Gen-AI and Machine Learning. (experience)
  • Deep understanding of packaging materials and their mechanical behaviors. (experience)
  • Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus. (experience)
  • Able to perform independent research and development work. (experience)
  • Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings. (experience)

Responsibilities

  • • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
  • • You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
  • Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
  • Actively exploring the feasibility during product package definition and identifying risks of reliability and product yield through simulation.
  • Supporting new product introduction (NPI), solving problems emerging from product development and manufacturing.
  • Programming or scripting CAD/FEM software, and Gen-AI/ML/numerical tools to set up automated model-generation user interfaces and maintain those codes.

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Apple logo

IC Packaging Simulation Engineer

Apple

Engineering Jobs

IC Packaging Simulation Engineer

full-timePosted: Oct 20, 2025

Job Description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization. • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. • You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.

Locations

  • Santa Clara, California, United States 95050

Salary

Estimated Salary Rangemedium confidence

25,000,000 - 45,000,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • attention to detailintermediate
  • proficiency in FEM simulationintermediate
  • proficiency in ANSYSintermediate
  • proficiency in ABAQUSintermediate
  • familiarity with simulation development processintermediate
  • familiarity with characterization projectsintermediate
  • collaboration skillsintermediate
  • stress simulationintermediate
  • deformation simulationintermediate
  • IC package simulationintermediate
  • chip-package interaction analysisintermediate
  • package-board interaction analysisintermediate
  • scripting CAD/FEM softwareintermediate
  • Generative AIintermediate
  • Machine Learningintermediate
  • numerical toolsintermediate
  • automated model-generationintermediate
  • user interface developmentintermediate

Required Qualifications

  • BS and 3+ years of relevant industry experience. (experience, 3 years)

Preferred Qualifications

  • Proven capability in mechanics and mathematics. (experience)
  • Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). (experience)
  • Proficiency with numerical simulation software tools and expert in MATLAB and/or Scientific Python. (experience)
  • Hands-on experience of Gen-AI and Machine Learning. (experience)
  • Deep understanding of packaging materials and their mechanical behaviors. (experience)
  • Knowledge of electronic packaging structures and processes, as well as its reliability, and package qualification requirements is a huge plus. (experience)
  • Able to perform independent research and development work. (experience)
  • Excellent written and verbal communication skills with ability to present ideas, design concepts, data, and plan with high confidence at team meetings. (experience)

Responsibilities

  • • In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
  • • You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
  • Numerical modeling of the stress and deformation of component packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability.
  • Actively exploring the feasibility during product package definition and identifying risks of reliability and product yield through simulation.
  • Supporting new product introduction (NPI), solving problems emerging from product development and manufacturing.
  • Programming or scripting CAD/FEM software, and Gen-AI/ML/numerical tools to set up automated model-generation user interfaces and maintain those codes.

Target Your Resume for "IC Packaging Simulation Engineer" , Apple

Get personalized recommendations to optimize your resume specifically for IC Packaging Simulation Engineer. Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "IC Packaging Simulation Engineer" , Apple

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Tags & Categories

Hardware

Answer 10 quick questions to check your fit for IC Packaging Simulation Engineer @ Apple.

Quiz Challenge
10 Questions
~2 Minutes
Instant Score

Related Books and Jobs

No related jobs found at the moment.