Packaging Substrate Engineer
Apple
Packaging Substrate Engineer
Job Description
Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job, and there's no telling what you could accomplish! Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance. -Lead SoC package substrate development, pathfinding technology, and roadmap definition. -Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. -Work across a variety of cross-functional groups directly and involve themselves in engineering and product development. -Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel.
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- passionintermediate
- dedicationintermediate
- package selectionintermediate
- product package structure optimizationintermediate
- package substrate designintermediate
- package substrate technologyintermediate
- package substrate manufacturingintermediate
- package substrate reliabilityintermediate
- roadmap developmentintermediate
- cross-functional collaborationintermediate
- SoC package substrate developmentintermediate
- pathfinding technologyintermediate
- roadmap definitionintermediate
- substrate manufacturing collaborationintermediate
- foundry collaborationintermediate
- OSAT collaborationintermediate
- concept to HVM transitionintermediate
- engineering involvementintermediate
- product development involvementintermediate
- sophisticated package solutionsintermediate
- new material developmentintermediate
- specs developmentintermediate
Required Qualifications
- BS and 10+ years of relevant industry experience. (experience, 10 years)
Preferred Qualifications
- MS or Ph.D. and 5+ years of relevant industry experience. (experience, 5 years)
- Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). (experience)
- In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap. (experience)
- Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist. (experience)
- Familiar with package assembly and integration process preferred. (experience)
- Experience in Cadence Allegro platform tools and design review for manufacturing (DFM). (experience)
- Exceptional technology development & project management skills. (experience)
- Strong communication & collaborative skills. (experience)
Responsibilities
- -Lead SoC package substrate development, pathfinding technology, and roadmap definition.
- -Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
- -Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.
- -Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel.
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Answer 10 quick questions to check your fit for Packaging Substrate Engineer @ Apple.
10 Questions
~2 Minutes
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Packaging Substrate Engineer
Apple
Packaging Substrate Engineer
Job Description
Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job, and there's no telling what you could accomplish! Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation product package structure and configuration optimization. You will be responsible for Apple Package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with a cross-functional team to achieve the best package performance. -Lead SoC package substrate development, pathfinding technology, and roadmap definition. -Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. -Work across a variety of cross-functional groups directly and involve themselves in engineering and product development. -Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel.
Locations
- Santa Clara, California, United States 95050
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- attention to detailintermediate
- passionintermediate
- dedicationintermediate
- package selectionintermediate
- product package structure optimizationintermediate
- package substrate designintermediate
- package substrate technologyintermediate
- package substrate manufacturingintermediate
- package substrate reliabilityintermediate
- roadmap developmentintermediate
- cross-functional collaborationintermediate
- SoC package substrate developmentintermediate
- pathfinding technologyintermediate
- roadmap definitionintermediate
- substrate manufacturing collaborationintermediate
- foundry collaborationintermediate
- OSAT collaborationintermediate
- concept to HVM transitionintermediate
- engineering involvementintermediate
- product development involvementintermediate
- sophisticated package solutionsintermediate
- new material developmentintermediate
- specs developmentintermediate
Required Qualifications
- BS and 10+ years of relevant industry experience. (experience, 10 years)
Preferred Qualifications
- MS or Ph.D. and 5+ years of relevant industry experience. (experience, 5 years)
- Proven fundamentals in the material/chemistry/ or mechanical engineering field(s). (experience)
- In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap. (experience)
- Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist. (experience)
- Familiar with package assembly and integration process preferred. (experience)
- Experience in Cadence Allegro platform tools and design review for manufacturing (DFM). (experience)
- Exceptional technology development & project management skills. (experience)
- Strong communication & collaborative skills. (experience)
Responsibilities
- -Lead SoC package substrate development, pathfinding technology, and roadmap definition.
- -Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM.
- -Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.
- -Drive industry with sophisticated package solutions, new material development, and specs. - 5% International travel.
Tags & Categories
Answer 10 quick questions to check your fit for Packaging Substrate Engineer @ Apple.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs