Silicon Photonics Flip-Chip Bonding Process Engineer
Apple
Silicon Photonics Flip-Chip Bonding Process Engineer
Job Description
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product! Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple’s customers every single day! Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
Locations
- Cupertino, California, United States 95014
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- passion for innovationintermediate
- dedicationintermediate
- strong understanding of design specificationsintermediate
- deep knowledge of process capabilities and limitationsintermediate
- thorough data analysisintermediate
- exceptional communication skillsintermediate
- high-precision flip-chip bonding processintermediate
- research and development of novel integrated photonics devicesintermediate
Required Qualifications
- BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field. (degree in optical engineering)
- Background in semiconductor process integration, particularly in the back-end section of the manufacturing process. (experience)
Preferred Qualifications
- 3+ years of relevant industry experience. (experience, 3 years)
- MS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field, with a background in semiconductor processing/fabrication. (degree in optical engineering)
- Hands-on experience with die bonder tools and processes, or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial). (experience)
- Experience working in a cleanroom environment setting. (experience)
- Strong problem solving ability and experience with material inspection, e.g. optical microscopes, metrology tools, etc. (experience)
- Electrical and optical test experience. (experience)
- Knowledge of statistical data analysis, with expertise in using relevant tools (e.g., JMP). (experience)
- Excellent communication skills, with the ability to work effectively in a team with diverse expertises. (experience)
Responsibilities
- Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
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Answer 10 quick questions to check your fit for Silicon Photonics Flip-Chip Bonding Process Engineer @ Apple.
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Silicon Photonics Flip-Chip Bonding Process Engineer
Apple
Silicon Photonics Flip-Chip Bonding Process Engineer
Job Description
Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, smart people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same passion for innovation that goes into our products also applies to our practices strengthening our commitment to leave the world better than we found it. Join us to help deliver the next groundbreaking Apple product! Do you love working on challenges that no one has solved yet? As a member of our dynamic group, you will have the unique and rewarding opportunity to craft upcoming products that will delight and inspire millions of Apple’s customers every single day! Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
Locations
- Cupertino, California, United States 95014
Salary
Estimated Salary Rangemedium confidence
25,000,000 - 50,000,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- passion for innovationintermediate
- dedicationintermediate
- strong understanding of design specificationsintermediate
- deep knowledge of process capabilities and limitationsintermediate
- thorough data analysisintermediate
- exceptional communication skillsintermediate
- high-precision flip-chip bonding processintermediate
- research and development of novel integrated photonics devicesintermediate
Required Qualifications
- BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field. (degree in optical engineering)
- Background in semiconductor process integration, particularly in the back-end section of the manufacturing process. (experience)
Preferred Qualifications
- 3+ years of relevant industry experience. (experience, 3 years)
- MS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field, with a background in semiconductor processing/fabrication. (degree in optical engineering)
- Hands-on experience with die bonder tools and processes, or similar high precision assembly tool (flip-chip eutectic AuSn bonding experience beneficial). (experience)
- Experience working in a cleanroom environment setting. (experience)
- Strong problem solving ability and experience with material inspection, e.g. optical microscopes, metrology tools, etc. (experience)
- Electrical and optical test experience. (experience)
- Knowledge of statistical data analysis, with expertise in using relevant tools (e.g., JMP). (experience)
- Excellent communication skills, with the ability to work effectively in a team with diverse expertises. (experience)
Responsibilities
- Apple's Biophotonics team is seeking a Flip-Chip bonding process engineer to join their rapidly expanding silicon photonics group. This individual will work on the research and development of novel integrated photonics devices in sensing applications, being primarily responsible for day-to-day operation, reporting, and documentation of a high-precision flip-chip bonding process. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
Tags & Categories
Answer 10 quick questions to check your fit for Silicon Photonics Flip-Chip Bonding Process Engineer @ Apple.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs