Job Description

Locations

• San Francisco Bay Area, California, United States

Salary

Skills Required

• Silicon photonics technologyintermediate
• optical interconnectsintermediate
• optical I/O module architectureintermediate
• optical coupling designintermediate
• single-mode fiber packagingintermediate
• Si photonics engine/chiplet packagingintermediate
• co-packaging solutionsintermediate
• advanced packaging technologiesintermediate
• assembly baseline processesintermediate
• package BOM definitionintermediate
• optical coupling manufacturingintermediate
• performance optimizationintermediate
• reliability optimizationintermediate
• yield optimizationintermediate
• cost optimizationintermediate
• packaging technology developmentintermediate
• cross-functional team collaborationintermediate
• optical engine module developmentintermediate
• fiber array connector developmentintermediate
• co-packaging optics developmentintermediate
• package integrationintermediate
• micro-optical component assemblyintermediate
• interface characterizationintermediate
• innovationintermediate
• vendor managementintermediate
• foundry collaborationintermediate
• OSAT collaborationintermediate
• high-volume manufacturing (HVM)intermediate
• international travelintermediate

Required Qualifications

• BS and 3+ years of relevant industry experience. (experience, 3 years)

Preferred Qualifications

• M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred. (experience)
• Excellent teamwork and communication skills. (experience)
• Strong theoretical background in optics and photonics fundamentals, device/module integration. (experience)
• Hands-on experience in packaging and measuring fiber-coupled devices. (experience)
• Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool. (experience)
• Min. 5 years works experiences in the related field with M.S and or Ph.D. (experience, 5 years)
• Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …) (experience)
• Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus. (experience)

Responsibilities

• Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
• Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance.
• Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
• Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
• Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
• Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.

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