Job Description

Locations

• San Francisco Bay Area, California, United States

Salary

Skills Required

• integration of physical layer (PHY) componentsintermediate
• optimization of physical layer (PHY) componentsintermediate
• chip-level bring-upintermediate
• Digital Signal Processing (DSP) implementationintermediate
• collaborating with cross-functional teamsintermediate

Required Qualifications

• BS and a minimum of 3 years relevant industry experience. (experience, 3 years)

Preferred Qualifications

• Proven experience in wireless communications, with a strong focus on PHY layer design and integration. (experience)
• Solid understanding of DSP concepts and experience with implementing DSP algorithms in real-time systems. (experience)
• Experience with chip-level bring-up, including familiarity with tools and techniques for hardware debugging. (experience)
• Experience with PHY/RF/MAC Verification. (experience)
• Experience of RF parametric testing such as EVM, ACPR, Rx sensitivity, blocker testing. (experience)
• Experience with lab equipment such as network analyzer, spectrum analyzer, oscilloscopes, DMM’s. (experience)
• Python programming is highly desirable. (experience)
• Knowledge of wireless protocols such as Bluetooth, WLAN, UWB. (experience)
• Verification skills in problem solving, constrained random testing, and debugging. (experience)

Responsibilities

• Your role will involve chip-level bring-up and Digital Signal Processing (DSP) implementation, collaborating with cross-functional teams to ensure seamless performance, compliance, and reliability of wireless connectivity solutions.
• Design, integrate and validate PHY layer components for wireless communication protocols (e.g., Bluetooth, Zigbee, UWB, etc.).
• Implement and optimize DSP algorithms for signal modulation, demodulation, filtering, and error correction to enhance wireless performance.
• Conduct FPGA and chip-level bring-up, including power-on testing, debug, and validation of PHY interfaces, PHY/RF/MAC functionalities and performance.
• Troubleshoot and resolve integration issues at the chip level, identifying root causes and implementing solutions.
• Design, execute and automate directed PHY/MAC testing scripts, which control and setup RF test equipment and RF chips.
• Validate and characterize algorithms on real silicon alongside RTL, PHY, RF, MAC, and board designers.
• Bring-up and take to production state-of-the-art physical layer wireless communication system algorithms for different wireless connectivity applications.
• Develop and implement test plans; collect and analyze test result; identify, root-cause, and debug issues.

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