Who We Are

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Key Responsibilities

• Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology​ and process

• Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.

• Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.

• Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.

• Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.

Functional Knowledge

• Good understanding of plasma physics and processes is essential.

• Practical background on any types of plasma technology and its characterization is needed.

• Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.

• Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.

• Any backgrounds of WoW or CoW bonding is a bonus.

Opportunities

• On-job training on CoW hybrid bonding processes and challenges.

• Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development.

• Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding

Requirements

• Engineering or science university educational background.

• > 2 years experiences on plasma HW/ process development preferred.

• 10% travel commitment to the US (California), Taiwan, Korea or Europe

Working Location

• Science Park II, Singapore

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Key Responsibilities

• Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process
• Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding.
• Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber.
• Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization.
• Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics.

Required Qualifications

• Engineering or science university educational background.
• > 2 years experiences on plasma HW/ process development preferred.
• 10% travel commitment to the US (California), Taiwan, Korea or Europe
• Working Location: Science Park II, Singapore

Required Skills

• Good understanding of plasma physics and processes is essential.
• Practical background on any types of plasma technology and its characterization is needed.
• Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology.
• Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus.
• Any backgrounds of WoW or CoW bonding is a bonus.

Benefits & Perks

• Supportive work culture that encourages you to learn, develop, and grow your career
• Programs and support that encourage personal and professional growth
• Care for you at work, at home, or wherever you may go.