Who We Are

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Salary:

$147,000.00 - $202,500.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

We are seeking a highly skilled Process Engineer with deep experience in photonics and advanced packaging technologies to support the development of high-performance photonic interconnects and co-packaged optical systems. This role is critical for enabling high-density, low-loss interconnects in next-generation computing, sensing, and communication platforms.

Key Responsibilities

• Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration.
• Lead Cu backplane RDL design, layout, fabrication, and integration.
• Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements.
• Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance.
• Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance.
• Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability.

Qualifications

• Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered).
• Proven experience in Cu RDL layout, design, fabrication, and integration.
• Hands-on expertise in thermal compression bonding and hybrid bonding processes.
• Experience with Co-Packaged Optics (CPO) and Optical Engine development.
• Experience working in cleanroom environments and advanced IC fabrication.
• Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys.
• Strong problem-solving skills and ability to work in a collaborative research environment.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

Key Responsibilities

• Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration.
• Lead Cu backplane RDL design, layout, fabrication, and integration.
• Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements.
• Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance.
• Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance.
• Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability.

Required Qualifications

• Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered).
• Proven experience in Cu RDL layout, design, fabrication, and integration.
• Hands-on expertise in thermal compression bonding and hybrid bonding processes.
• Experience with Co-Packaged Optics (CPO) and Optical Engine development.
• Experience working in cleanroom environments and advanced IC fabrication.
• Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys.
• Strong problem-solving skills and ability to work in a collaborative research environment.

Required Skills

• Photonics and advanced packaging technologies
• Cu backplane RDL design, layout, fabrication, and integration
• Mass transfer and die bonding solutions
• Thermal compression bonding and hybrid bonding
• Co-Packaged Optics (CPO) and Optical Engine development
• Thermal, mechanical, and optical simulations
• Optical, electrical, and tolerance analysis
• Cleanroom environments and advanced IC fabrication
• Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL, Ansys

Benefits & Perks

• Supportive work culture that encourages learning, development, and career growth
• Comprehensive benefits package
• Programs and support for personal and professional growth
• Care for health and wellbeing at work, home, or elsewhere
• Potential eligibility for bonus and stock award program

Compensation

877-612