RESUME AND JOB
Bosch Group
· Responsible for ASIC qualification, yield improvement in engineering and ramp up phase
· Collaborate with internal R&D and external subcontractors to enhance product robustness for manufacturability
· ASIC owner and take full responsibility in mass production, e.g. yield monitor/improvement, cost down
· Perform electrical and physical failure analysis to understand failure mechanism
· Perform data mining and analysis to find root cause for any excursion and issues
· Supplier management focus on qualification and failure analysis house, wafer foundry and wafer test OSATs
· Master or Bachelor Degree in Device Physics, Electrical/Electronic Engineering or equivalent
· At least 4-6 years' experience at semiconductor foundry or fabless-IC design house as Product Engineering
· Good understanding of CMOS fab processes (logic and mixed-signal process)
· Able to do data mining and correlation analysis on process parameters and electrical test parameters
· Experience on IC failure analysis and fault localization techniques
· Knowledge/experience on ASIC test and final test is highly preferred
· Knowledge of product development, design of mixed-signal circuits is highly preferred
· Willingness to work and interact in international teams, English written and verbal must be
· Self-motivated, excellent communication skills and team spirit
· Ability to independently manage projects and subcontractors
· Package Assembly knowledge will be a plus
75,000 - 130,000 CNY / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
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Bosch Group
· Responsible for ASIC qualification, yield improvement in engineering and ramp up phase
· Collaborate with internal R&D and external subcontractors to enhance product robustness for manufacturability
· ASIC owner and take full responsibility in mass production, e.g. yield monitor/improvement, cost down
· Perform electrical and physical failure analysis to understand failure mechanism
· Perform data mining and analysis to find root cause for any excursion and issues
· Supplier management focus on qualification and failure analysis house, wafer foundry and wafer test OSATs
· Master or Bachelor Degree in Device Physics, Electrical/Electronic Engineering or equivalent
· At least 4-6 years' experience at semiconductor foundry or fabless-IC design house as Product Engineering
· Good understanding of CMOS fab processes (logic and mixed-signal process)
· Able to do data mining and correlation analysis on process parameters and electrical test parameters
· Experience on IC failure analysis and fault localization techniques
· Knowledge/experience on ASIC test and final test is highly preferred
· Knowledge of product development, design of mixed-signal circuits is highly preferred
· Willingness to work and interact in international teams, English written and verbal must be
· Self-motivated, excellent communication skills and team spirit
· Ability to independently manage projects and subcontractors
· Package Assembly knowledge will be a plus
75,000 - 130,000 CNY / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Get personalized recommendations to optimize your resume specifically for ASIC Product Engineer_BST. Takes only 15 seconds!
Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.
Answer 10 quick questions to check your fit for ASIC Product Engineer_BST @ Bosch Group.

No related jobs found at the moment.

© 2026 Pointers. All rights reserved.