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Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)

Bosch Group

Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)

full-timePosted: Jan 17, 2026

Job Description

Description

We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs, machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices.

  • Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier.
  • Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages.
  • Part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production, and quality team members.
  • Responsible for the material and machine selection and associated process development for core assembly steps.
  • Selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers).
  • Co-working with equipment suppliers to enhance existing or to develop new machines.
  • Take care of the development, qualification, and transfer to mass production of new assembly processes and materials.
  • Owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials.

Qualifications

  • Education: Master or Bachelor degree in material or natural science (physics, chemistry), or mechanical / electrical engineering or material science.
  • Experience and Skills: Minimum of 3 years, preferred 7 years of experience in sensor and/or package development.
  • Knowledge and skills in EOL assemble handling, BGA, QFN, LGA, MEMS packages, FOL, EOL assembly, FMEA, SPC, and 8D.
  • Personality: team player, problem solver, broad technical interests, creativity, initiative, autonomy, flexibility, leadership, agility, with ability to work with minimum supervision.
  • Languages: Very good English skills in speaking and writing.
  • Intercultural Skills: Willingness to travel.

Additional Info

Your future job offers you.

Flexible work time, medical services, and benefits & services.

Company Description

At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in
and feel the difference.

Robert Bosch Inc. (Philippines) has diversified businesses in Power Tools, Automotive Aftermarket, Automotive Original Equipment, Building Technologies, Thermotechnology, and Drive and Control Technology (Bosch Rexroth). Additionally, the company’s Packaging Technology and Home Appliances businesses are represented through appointed local agents. In 2017, Bosch generated sales of USD 51 million (45 million euros) in the Philippines. Bosch continues to build its nationwide network as a socially responsible provider of innovative and beneficial technologies to the Philippines.

Locations

  • Unit B, 11F TenWest Campus Le Grand, Fort Bonifacio, Taguig City, Metro Manila, Philippines

Salary

Estimated Salary Rangemedium confidence

75,000 - 130,000 USD / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • MEMS assembly and interconnect technologiesintermediate
  • EOL assembly handlingintermediate
  • BGA, QFN, LGA, MEMS packagesintermediate
  • FMEA, SPC, 8Dintermediate
  • Supplier qualificationintermediate

Required Qualifications

  • Master or Bachelor in material/natural science, mechanical/electrical engineering (experience)
  • Minimum 3 years (preferred 7 years) sensor/package development experience (experience)
  • Very good English skills (experience)

Responsibilities

  • Develop packaging processes for MEMS devices
  • Work on-site at assembly partners
  • Select and qualify suppliers
  • Develop and qualify new assembly processes
  • Own specifications and technical documentation
  • Transfer processes to mass production

Benefits

  • general: Flexible work time
  • general: Medical services
  • general: Benefits & services

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Bosch Group logo

Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)

Bosch Group

Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)

full-timePosted: Jan 17, 2026

Job Description

Description

We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs, machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices.

  • Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier.
  • Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages.
  • Part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production, and quality team members.
  • Responsible for the material and machine selection and associated process development for core assembly steps.
  • Selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers).
  • Co-working with equipment suppliers to enhance existing or to develop new machines.
  • Take care of the development, qualification, and transfer to mass production of new assembly processes and materials.
  • Owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials.

Qualifications

  • Education: Master or Bachelor degree in material or natural science (physics, chemistry), or mechanical / electrical engineering or material science.
  • Experience and Skills: Minimum of 3 years, preferred 7 years of experience in sensor and/or package development.
  • Knowledge and skills in EOL assemble handling, BGA, QFN, LGA, MEMS packages, FOL, EOL assembly, FMEA, SPC, and 8D.
  • Personality: team player, problem solver, broad technical interests, creativity, initiative, autonomy, flexibility, leadership, agility, with ability to work with minimum supervision.
  • Languages: Very good English skills in speaking and writing.
  • Intercultural Skills: Willingness to travel.

Additional Info

Your future job offers you.

Flexible work time, medical services, and benefits & services.

Company Description

At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in
and feel the difference.

Robert Bosch Inc. (Philippines) has diversified businesses in Power Tools, Automotive Aftermarket, Automotive Original Equipment, Building Technologies, Thermotechnology, and Drive and Control Technology (Bosch Rexroth). Additionally, the company’s Packaging Technology and Home Appliances businesses are represented through appointed local agents. In 2017, Bosch generated sales of USD 51 million (45 million euros) in the Philippines. Bosch continues to build its nationwide network as a socially responsible provider of innovative and beneficial technologies to the Philippines.

Locations

  • Unit B, 11F TenWest Campus Le Grand, Fort Bonifacio, Taguig City, Metro Manila, Philippines

Salary

Estimated Salary Rangemedium confidence

75,000 - 130,000 USD / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • MEMS assembly and interconnect technologiesintermediate
  • EOL assembly handlingintermediate
  • BGA, QFN, LGA, MEMS packagesintermediate
  • FMEA, SPC, 8Dintermediate
  • Supplier qualificationintermediate

Required Qualifications

  • Master or Bachelor in material/natural science, mechanical/electrical engineering (experience)
  • Minimum 3 years (preferred 7 years) sensor/package development experience (experience)
  • Very good English skills (experience)

Responsibilities

  • Develop packaging processes for MEMS devices
  • Work on-site at assembly partners
  • Select and qualify suppliers
  • Develop and qualify new assembly processes
  • Own specifications and technical documentation
  • Transfer processes to mass production

Benefits

  • general: Flexible work time
  • general: Medical services
  • general: Benefits & services

Target Your Resume for "Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)" , Bosch Group

Get personalized recommendations to optimize your resume specifically for Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging). Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)" , Bosch Group

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Answer 10 quick questions to check your fit for Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging) @ Bosch Group.

Quiz Challenge
10 Questions
~2 Minutes
Instant Score

Related Books and Jobs

No related jobs found at the moment.