Electronics Engineer Intern

Location: Sant Cugat del Valles, Barcelona, Spain

Department: Your Privacy

About the Role

Join HP Inc.'s Barcelona campus, home to the 3D Printing global headquarters—one of the world's largest and most advanced R&D facilities pioneering next-generation technologies for the Fourth Industrial Revolution. As an Electronics Engineer Intern in the 3D Printing Research and Development department's Electronics Engineering team, you'll collaborate closely with multidisciplinary R&D engineers and receive dedicated guidance from a personal tutor. This internship offers hands-on experience designing innovative electronics that power HP's customer-centric 3D printing solutions, fostering your growth in a culture of collaboration, innovation, and technological excellence. Key responsibilities include investigating and prototyping new electronic concepts, designing functional circuits, leveraging MATLAB/Simulink for HIL and SIL simulations, analyzing circuit performance against simulations, developing microcontroller code in C/C++ for control functions, and creating auxiliary circuits for validation. You'll contribute directly to HP's mission of reshaping manufacturing through cutting-edge hardware, gaining exposure to real-world challenges in embedded systems and advanced simulation techniques while embodying our commitment to customer-focused innovation. We're seeking 3rd/4th-year Bachelor's or Master's students in Electronics or Telecommunications Engineering, currently enrolled in a Spanish university, with a solid electronics foundation, simulation tool familiarity (MATLAB, Simulink, SPICE), microcontroller programming skills, strong analytical abilities, initiative for autonomous work, and fluent English. Preferred candidates bring experience in HIL/SIL or 3D printing electronics. Available from February to June/July 2026, you'll thrive in HP's dynamic environment that values every voice and drives career mobility across 170+ countries. HP offers unparalleled benefits including flexible hybrid work, complimentary cafeteria lunches, a premier sports center with diverse activities, NextGen networking events, and free 3D printing workshops—empowering you to make an impact in a supportive, innovative community dedicated to professional growth and technological leadership.

Key Responsibilities

• Investigate, simulate, and prototype new concepts and design ideas for 3D printing electronics
• Design functional electronic circuits for next-generation 3D printing systems
• Investigate and apply simulation techniques including HIL and SIL using MATLAB/Simulink tools
• Analyze and measure the performance of electronic circuits, comparing results with simulations
• Develop portions of microcontroller code to implement control functionality
• Design and develop auxiliary circuits for characterizing and validating electronics
• Collaborate with multidisciplinary R&D engineers in HP's 3D Printing global headquarters
• Contribute to innovative solutions driving the Fourth Industrial Revolution
• Work under the guidance of a dedicated tutor to ensure project success
• Support the integration of electronics in advanced 3D printing technologies

Required Qualifications

• Currently enrolled in a Bachelor's or Master's degree in Electronics or Telecommunications Engineering at a university in Spain, remaining enrolled until the end of the internship
• Available to start the internship in February 2026 and continue until June–July 2026
• Solid background in electronics discipline
• Familiar with electronic and system simulation tools (Matlab, Simulink, Spice, etc.)
• Microcontroller programming skills (C, C++)
• Fluent in English
• 3rd or 4th year student with enthusiasm for new technologies

Preferred Qualifications

• Experience with HIL (Hardware-in-the-Loop) and SIL (Software-in-the-Loop) simulation techniques
• Hands-on experience prototyping electronic circuits
• Knowledge of embedded systems development
• Prior exposure to 3D printing or advanced manufacturing technologies
• Familiarity with circuit characterization and validation methods

Required Skills

• Electronics circuit design
• MATLAB/Simulink proficiency
• SPICE simulation
• Microcontroller programming (C/C++)
• HIL/SIL simulation techniques
• Embedded systems development
• Circuit performance analysis and measurement
• Prototyping and validation
• Analytical problem-solving
• Autonomous working initiative
• Team collaboration in multidisciplinary environments
• English fluency (written and spoken)
• Technical simulation tools expertise
• Control systems implementation
• Innovation mindset
• Attention to detail in hardware testing

Benefits

• Access to HP's international community with growth opportunities and professional development resources
• Flexible hybrid or office-based work style with part-time (4h/day) or full-time (8h/day) options
• 6-12 month internship agreement with flexible scheduling
• Complimentary lunches in the on-site cafeteria
• State-of-the-art sports center with gym, squash, tennis, basketball courts, and 25+ coordinated activities including HIIT, yoga, and more
• NextGen employee network hosting regular fun events
• Free printing happy hours and hands-on workshops with cutting-edge 3D printing technology
• Networking opportunities within HP's innovation-driven culture

HP Inc. is an equal opportunity employer.