Hardware and Systems Development Interns – 2026 (Multiple Openings)
IBM
Hardware and Systems Development Interns – 2026 (Multiple Openings)
Job Description
Hardware and Systems Development Interns – 2026 (Multiple Openings)
📋 Job Overview
IBM Hardware and Systems Development Interns will work on designing, prototyping, and testing next-generation hardware across various engineering disciplines. Interns will collaborate on projects involving mechanical, electrical, optical, and firmware designs, using advanced tools and technologies to support IBM's high-performance systems portfolio.
📍 Location: Multiple Locations (Remote/Hybrid)
💼 Career Level: Internship
🎯 Key Responsibilities
- Collaborate across disciplines to design, model, and validate next-generation hardware
- Support mechanical, thermal, electrical, optical, and logic designs using CAD, EDA, and simulation tools
- Participate in PCB layout, power and signal integrity, circuit design, firmware development, and system bring-up
- Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects
- Write scripts or automation tools using Python, C/C++, or Bash to support testing and validation
✅ Required Qualifications
- B.S. or M.S. student in Mechanical, Electrical, Computer, Materials, Chemical, Industrial, or related Engineering disciplines
- Strong academic background with interest in hardware design, optics, logic, process, or materials engineering
- Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS)
- Programming experience with Python, C/C++, or Bash for automation or data analysis
- Strong analytical, problem-solving, and teamwork skills
⭐ Preferred Qualifications
- Experience with firmware development, test automation, or embedded systems
- Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment)
- Familiarity with design-of-experiments (DOE) or project management in a research or lab environment
- Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering
- M.S. or Ph.D. students with research focus in electrical packaging, photonics, signal integrity, or thermal design
🛠️ Required Skills
- CAD tools (SolidWorks, AutoCAD, Allegro, Cadence)
- Simulation tools (CFD, FEM, HFSS)
- Programming (Python, C/C++, Bash)
- Analytical skills
- Problem-solving skills
- Teamwork skills
- EDA tools
- PCB layout
- Power and signal integrity
- Circuit design
- Firmware development
- System bring-up
- Data analysis
- Automation tools
- Mechanical & Thermal Design (SolidWorks, CFD, FEM, design-for-manufacturing, reliability testing)
- Electrical & Logic Design (PCB/IC layout, digital logic, circuit and system design)
- Optics & Photonics (Fiber optics, photonics, lasers, optical networking, datacenter systems)
- Firmware & Automation (Embedded systems, firmware test, scripting, hardware debug)
- Materials & Process Engineering (Composites, metallurgy, heat transfer, process development)
- Lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, optical test equipment)
- Design-of-experiments (DOE)
- Project management
🎁 Benefits & Perks
- Opportunities for learning and development
- Encouragement to be courageous and experiment
- Continuous trust and support in an inclusive environment
- Growth-minded culture with openness to feedback and learning
- Collaboration with colleagues for exceptional customer outcomes
Locations
- Multiple Locations, India (Remote)
Salary
Estimated Salary Rangemedium confidence
300,000 - 600,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- CAD tools (SolidWorks, AutoCAD, Allegro, Cadence)intermediate
- Simulation tools (CFD, FEM, HFSS)intermediate
- Programming (Python, C/C++, Bash)intermediate
- Analytical skillsintermediate
- Problem-solving skillsintermediate
- Teamwork skillsintermediate
- EDA toolsintermediate
- PCB layoutintermediate
- Power and signal integrityintermediate
- Circuit designintermediate
- Firmware developmentintermediate
- System bring-upintermediate
- Data analysisintermediate
- Automation toolsintermediate
- Mechanical & Thermal Design (SolidWorks, CFD, FEM, design-for-manufacturing, reliability testing)intermediate
- Electrical & Logic Design (PCB/IC layout, digital logic, circuit and system design)intermediate
- Optics & Photonics (Fiber optics, photonics, lasers, optical networking, datacenter systems)intermediate
- Firmware & Automation (Embedded systems, firmware test, scripting, hardware debug)intermediate
- Materials & Process Engineering (Composites, metallurgy, heat transfer, process development)intermediate
- Lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, optical test equipment)intermediate
- Design-of-experiments (DOE)intermediate
- Project managementintermediate
Required Qualifications
- B.S. or M.S. student in Mechanical, Electrical, Computer, Materials, Chemical, Industrial, or related Engineering disciplines (experience)
- Strong academic background with interest in hardware design, optics, logic, process, or materials engineering (experience)
- Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS) (experience)
- Programming experience with Python, C/C++, or Bash for automation or data analysis (experience)
- Strong analytical, problem-solving, and teamwork skills (experience)
Preferred Qualifications
- Experience with firmware development, test automation, or embedded systems (experience)
- Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment) (experience)
- Familiarity with design-of-experiments (DOE) or project management in a research or lab environment (experience)
- Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering (experience)
- M.S. or Ph.D. students with research focus in electrical packaging, photonics, signal integrity, or thermal design (experience)
Responsibilities
- Collaborate across disciplines to design, model, and validate next-generation hardware
- Support mechanical, thermal, electrical, optical, and logic designs using CAD, EDA, and simulation tools
- Participate in PCB layout, power and signal integrity, circuit design, firmware development, and system bring-up
- Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects
- Write scripts or automation tools using Python, C/C++, or Bash to support testing and validation
Benefits
- general: Opportunities for learning and development
- general: Encouragement to be courageous and experiment
- general: Continuous trust and support in an inclusive environment
- general: Growth-minded culture with openness to feedback and learning
- general: Collaboration with colleagues for exceptional customer outcomes
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Answer 10 quick questions to check your fit for Hardware and Systems Development Interns – 2026 (Multiple Openings) @ IBM.
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Hardware and Systems Development Interns – 2026 (Multiple Openings)
IBM
Hardware and Systems Development Interns – 2026 (Multiple Openings)
Job Description
Hardware and Systems Development Interns – 2026 (Multiple Openings)
📋 Job Overview
IBM Hardware and Systems Development Interns will work on designing, prototyping, and testing next-generation hardware across various engineering disciplines. Interns will collaborate on projects involving mechanical, electrical, optical, and firmware designs, using advanced tools and technologies to support IBM's high-performance systems portfolio.
📍 Location: Multiple Locations (Remote/Hybrid)
💼 Career Level: Internship
🎯 Key Responsibilities
- Collaborate across disciplines to design, model, and validate next-generation hardware
- Support mechanical, thermal, electrical, optical, and logic designs using CAD, EDA, and simulation tools
- Participate in PCB layout, power and signal integrity, circuit design, firmware development, and system bring-up
- Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects
- Write scripts or automation tools using Python, C/C++, or Bash to support testing and validation
✅ Required Qualifications
- B.S. or M.S. student in Mechanical, Electrical, Computer, Materials, Chemical, Industrial, or related Engineering disciplines
- Strong academic background with interest in hardware design, optics, logic, process, or materials engineering
- Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS)
- Programming experience with Python, C/C++, or Bash for automation or data analysis
- Strong analytical, problem-solving, and teamwork skills
⭐ Preferred Qualifications
- Experience with firmware development, test automation, or embedded systems
- Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment)
- Familiarity with design-of-experiments (DOE) or project management in a research or lab environment
- Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering
- M.S. or Ph.D. students with research focus in electrical packaging, photonics, signal integrity, or thermal design
🛠️ Required Skills
- CAD tools (SolidWorks, AutoCAD, Allegro, Cadence)
- Simulation tools (CFD, FEM, HFSS)
- Programming (Python, C/C++, Bash)
- Analytical skills
- Problem-solving skills
- Teamwork skills
- EDA tools
- PCB layout
- Power and signal integrity
- Circuit design
- Firmware development
- System bring-up
- Data analysis
- Automation tools
- Mechanical & Thermal Design (SolidWorks, CFD, FEM, design-for-manufacturing, reliability testing)
- Electrical & Logic Design (PCB/IC layout, digital logic, circuit and system design)
- Optics & Photonics (Fiber optics, photonics, lasers, optical networking, datacenter systems)
- Firmware & Automation (Embedded systems, firmware test, scripting, hardware debug)
- Materials & Process Engineering (Composites, metallurgy, heat transfer, process development)
- Lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, optical test equipment)
- Design-of-experiments (DOE)
- Project management
🎁 Benefits & Perks
- Opportunities for learning and development
- Encouragement to be courageous and experiment
- Continuous trust and support in an inclusive environment
- Growth-minded culture with openness to feedback and learning
- Collaboration with colleagues for exceptional customer outcomes
Locations
- Multiple Locations, India (Remote)
Salary
Estimated Salary Rangemedium confidence
300,000 - 600,000 INR / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Skills Required
- CAD tools (SolidWorks, AutoCAD, Allegro, Cadence)intermediate
- Simulation tools (CFD, FEM, HFSS)intermediate
- Programming (Python, C/C++, Bash)intermediate
- Analytical skillsintermediate
- Problem-solving skillsintermediate
- Teamwork skillsintermediate
- EDA toolsintermediate
- PCB layoutintermediate
- Power and signal integrityintermediate
- Circuit designintermediate
- Firmware developmentintermediate
- System bring-upintermediate
- Data analysisintermediate
- Automation toolsintermediate
- Mechanical & Thermal Design (SolidWorks, CFD, FEM, design-for-manufacturing, reliability testing)intermediate
- Electrical & Logic Design (PCB/IC layout, digital logic, circuit and system design)intermediate
- Optics & Photonics (Fiber optics, photonics, lasers, optical networking, datacenter systems)intermediate
- Firmware & Automation (Embedded systems, firmware test, scripting, hardware debug)intermediate
- Materials & Process Engineering (Composites, metallurgy, heat transfer, process development)intermediate
- Lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, optical test equipment)intermediate
- Design-of-experiments (DOE)intermediate
- Project managementintermediate
Required Qualifications
- B.S. or M.S. student in Mechanical, Electrical, Computer, Materials, Chemical, Industrial, or related Engineering disciplines (experience)
- Strong academic background with interest in hardware design, optics, logic, process, or materials engineering (experience)
- Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS) (experience)
- Programming experience with Python, C/C++, or Bash for automation or data analysis (experience)
- Strong analytical, problem-solving, and teamwork skills (experience)
Preferred Qualifications
- Experience with firmware development, test automation, or embedded systems (experience)
- Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment) (experience)
- Familiarity with design-of-experiments (DOE) or project management in a research or lab environment (experience)
- Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering (experience)
- M.S. or Ph.D. students with research focus in electrical packaging, photonics, signal integrity, or thermal design (experience)
Responsibilities
- Collaborate across disciplines to design, model, and validate next-generation hardware
- Support mechanical, thermal, electrical, optical, and logic designs using CAD, EDA, and simulation tools
- Participate in PCB layout, power and signal integrity, circuit design, firmware development, and system bring-up
- Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects
- Write scripts or automation tools using Python, C/C++, or Bash to support testing and validation
Benefits
- general: Opportunities for learning and development
- general: Encouragement to be courageous and experiment
- general: Continuous trust and support in an inclusive environment
- general: Growth-minded culture with openness to feedback and learning
- general: Collaboration with colleagues for exceptional customer outcomes
Tags & Categories
Answer 10 quick questions to check your fit for Hardware and Systems Development Interns – 2026 (Multiple Openings) @ IBM.
10 Questions
~2 Minutes
Instant Score
Related Books and Jobs