Resume and JobRESUME AND JOB
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Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

IBM

Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

IBM logo

IBM

full-time

Posted: December 12, 2025

Number of Vacancies: 1

Job Description

Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

📋 Job Overview

The role involves working in a dynamic, high-tech industrial environment at IBM's Bromont facility, focusing on the development and introduction of new microelectronic products from design to qualification. The position requires expertise in thermomechanical modeling to guide design choices, support product development and production teams, and enhance the facility's growth as an OSAT. Candidates must be Canadian citizens or permanent residents and comply with Canadian Controlled Goods and ITAR regulations.

📍 Location: BROMONT, CA

💼 Career Level: Professional

🎯 Key Responsibilities

  • Develop new multiphysics predictive models to simulate assembly, operation, and reliability conditions, evaluate performance, and estimate failure risks
  • Develop FEA methods for microelectronics challenges: micron to centimeter scale, composite materials, creep, viscoelasticity, mesh control, multi-scale analyses, capillary behaviors, etc.
  • Program and maintain collaborative modeling solutions in Python deployed in a distributed computing Linux Enterprise environment (RHEL, OpenShift)
  • Experimentally characterize sets of metallic and composite materials in elastic, viscoelastic, and plastic regimes at various temperatures and very small scales (~1 micron) using sophisticated measurement equipment
  • Conduct analyses, produce reports, and communicate results to internal and external clients during various phases of the development and qualification cycle
  • Support engineers from Development, Quality, and Reliability groups in finding root causes and solutions to thermomechanical microelectronic assembly issues (adhesion, delamination, process optimization, failure source control, etc.)

✅ Required Qualifications

  • Master's or PhD in physical engineering, mechanical engineering, metallurgical engineering, materials engineering, materials science, physics, or equivalent
  • Experience in finite element modeling using ANSYS and/or other commercial or open-source software
  • Experience in materials science: metallurgy, composite materials, viscoelastic behaviors, creep, failure modes, etc.
  • Experience in material characterization and experimental setups: understanding issues related to property measurements and data validation acquisition
  • Ability to analyze, find root causes, and solve problems
  • Good knowledge of English, both spoken and written
  • Must be a Canadian citizen or permanent resident
  • Must comply with Canadian Controlled Goods and ITAR regulations

🛠️ Required Skills

  • Thermomechanical modeling
  • Finite Element Analysis (FEA)
  • Python
  • Linux Enterprise (RHEL, OpenShift)
  • Materials characterization
  • Data analysis and reporting
  • Communication skills
  • Problem-solving
  • Root cause analysis
  • Metallurgy
  • Composite materials
  • Viscoelastic behaviors
  • Creep
  • Failure modes
  • English proficiency

🎁 Benefits & Perks

  • Opportunity to learn and develop career
  • Encouragement to be courageous and experiment daily
  • Continuous trust and support in an inclusive environment
  • Growth-minded culture with openness to feedback and learning
  • Collaboration with colleagues for team-focused outcomes
  • Equal-opportunity employment without discrimination

Locations

  • BROMONT, CA, India

Salary

Estimated Salary Rangemedium confidence

2,500,000 - 4,200,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • Thermomechanical modelingintermediate
  • Finite Element Analysis (FEA)intermediate
  • Pythonintermediate
  • Linux Enterprise (RHEL, OpenShift)intermediate
  • Materials characterizationintermediate
  • Data analysis and reportingintermediate
  • Communication skillsintermediate
  • Problem-solvingintermediate
  • Root cause analysisintermediate
  • Metallurgyintermediate
  • Composite materialsintermediate
  • Viscoelastic behaviorsintermediate
  • Creepintermediate
  • Failure modesintermediate
  • English proficiencyintermediate

Required Qualifications

  • Master's or PhD in physical engineering, mechanical engineering, metallurgical engineering, materials engineering, materials science, physics, or equivalent (experience)
  • Experience in finite element modeling using ANSYS and/or other commercial or open-source software (experience)
  • Experience in materials science: metallurgy, composite materials, viscoelastic behaviors, creep, failure modes, etc. (experience)
  • Experience in material characterization and experimental setups: understanding issues related to property measurements and data validation acquisition (experience)
  • Ability to analyze, find root causes, and solve problems (experience)
  • Good knowledge of English, both spoken and written (experience)
  • Must be a Canadian citizen or permanent resident (experience)
  • Must comply with Canadian Controlled Goods and ITAR regulations (experience)

Responsibilities

  • Develop new multiphysics predictive models to simulate assembly, operation, and reliability conditions, evaluate performance, and estimate failure risks
  • Develop FEA methods for microelectronics challenges: micron to centimeter scale, composite materials, creep, viscoelasticity, mesh control, multi-scale analyses, capillary behaviors, etc.
  • Program and maintain collaborative modeling solutions in Python deployed in a distributed computing Linux Enterprise environment (RHEL, OpenShift)
  • Experimentally characterize sets of metallic and composite materials in elastic, viscoelastic, and plastic regimes at various temperatures and very small scales (~1 micron) using sophisticated measurement equipment
  • Conduct analyses, produce reports, and communicate results to internal and external clients during various phases of the development and qualification cycle
  • Support engineers from Development, Quality, and Reliability groups in finding root causes and solutions to thermomechanical microelectronic assembly issues (adhesion, delamination, process optimization, failure source control, etc.)

Benefits

  • general: Opportunity to learn and develop career
  • general: Encouragement to be courageous and experiment daily
  • general: Continuous trust and support in an inclusive environment
  • general: Growth-minded culture with openness to feedback and learning
  • general: Collaboration with colleagues for team-focused outcomes
  • general: Equal-opportunity employment without discrimination

Target Your Resume for "Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique" , IBM

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IBM logo

Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

IBM

Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

IBM logo

IBM

full-time

Posted: December 12, 2025

Number of Vacancies: 1

Job Description

Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique

📋 Job Overview

The role involves working in a dynamic, high-tech industrial environment at IBM's Bromont facility, focusing on the development and introduction of new microelectronic products from design to qualification. The position requires expertise in thermomechanical modeling to guide design choices, support product development and production teams, and enhance the facility's growth as an OSAT. Candidates must be Canadian citizens or permanent residents and comply with Canadian Controlled Goods and ITAR regulations.

📍 Location: BROMONT, CA

💼 Career Level: Professional

🎯 Key Responsibilities

  • Develop new multiphysics predictive models to simulate assembly, operation, and reliability conditions, evaluate performance, and estimate failure risks
  • Develop FEA methods for microelectronics challenges: micron to centimeter scale, composite materials, creep, viscoelasticity, mesh control, multi-scale analyses, capillary behaviors, etc.
  • Program and maintain collaborative modeling solutions in Python deployed in a distributed computing Linux Enterprise environment (RHEL, OpenShift)
  • Experimentally characterize sets of metallic and composite materials in elastic, viscoelastic, and plastic regimes at various temperatures and very small scales (~1 micron) using sophisticated measurement equipment
  • Conduct analyses, produce reports, and communicate results to internal and external clients during various phases of the development and qualification cycle
  • Support engineers from Development, Quality, and Reliability groups in finding root causes and solutions to thermomechanical microelectronic assembly issues (adhesion, delamination, process optimization, failure source control, etc.)

✅ Required Qualifications

  • Master's or PhD in physical engineering, mechanical engineering, metallurgical engineering, materials engineering, materials science, physics, or equivalent
  • Experience in finite element modeling using ANSYS and/or other commercial or open-source software
  • Experience in materials science: metallurgy, composite materials, viscoelastic behaviors, creep, failure modes, etc.
  • Experience in material characterization and experimental setups: understanding issues related to property measurements and data validation acquisition
  • Ability to analyze, find root causes, and solve problems
  • Good knowledge of English, both spoken and written
  • Must be a Canadian citizen or permanent resident
  • Must comply with Canadian Controlled Goods and ITAR regulations

🛠️ Required Skills

  • Thermomechanical modeling
  • Finite Element Analysis (FEA)
  • Python
  • Linux Enterprise (RHEL, OpenShift)
  • Materials characterization
  • Data analysis and reporting
  • Communication skills
  • Problem-solving
  • Root cause analysis
  • Metallurgy
  • Composite materials
  • Viscoelastic behaviors
  • Creep
  • Failure modes
  • English proficiency

🎁 Benefits & Perks

  • Opportunity to learn and develop career
  • Encouragement to be courageous and experiment daily
  • Continuous trust and support in an inclusive environment
  • Growth-minded culture with openness to feedback and learning
  • Collaboration with colleagues for team-focused outcomes
  • Equal-opportunity employment without discrimination

Locations

  • BROMONT, CA, India

Salary

Estimated Salary Rangemedium confidence

2,500,000 - 4,200,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • Thermomechanical modelingintermediate
  • Finite Element Analysis (FEA)intermediate
  • Pythonintermediate
  • Linux Enterprise (RHEL, OpenShift)intermediate
  • Materials characterizationintermediate
  • Data analysis and reportingintermediate
  • Communication skillsintermediate
  • Problem-solvingintermediate
  • Root cause analysisintermediate
  • Metallurgyintermediate
  • Composite materialsintermediate
  • Viscoelastic behaviorsintermediate
  • Creepintermediate
  • Failure modesintermediate
  • English proficiencyintermediate

Required Qualifications

  • Master's or PhD in physical engineering, mechanical engineering, metallurgical engineering, materials engineering, materials science, physics, or equivalent (experience)
  • Experience in finite element modeling using ANSYS and/or other commercial or open-source software (experience)
  • Experience in materials science: metallurgy, composite materials, viscoelastic behaviors, creep, failure modes, etc. (experience)
  • Experience in material characterization and experimental setups: understanding issues related to property measurements and data validation acquisition (experience)
  • Ability to analyze, find root causes, and solve problems (experience)
  • Good knowledge of English, both spoken and written (experience)
  • Must be a Canadian citizen or permanent resident (experience)
  • Must comply with Canadian Controlled Goods and ITAR regulations (experience)

Responsibilities

  • Develop new multiphysics predictive models to simulate assembly, operation, and reliability conditions, evaluate performance, and estimate failure risks
  • Develop FEA methods for microelectronics challenges: micron to centimeter scale, composite materials, creep, viscoelasticity, mesh control, multi-scale analyses, capillary behaviors, etc.
  • Program and maintain collaborative modeling solutions in Python deployed in a distributed computing Linux Enterprise environment (RHEL, OpenShift)
  • Experimentally characterize sets of metallic and composite materials in elastic, viscoelastic, and plastic regimes at various temperatures and very small scales (~1 micron) using sophisticated measurement equipment
  • Conduct analyses, produce reports, and communicate results to internal and external clients during various phases of the development and qualification cycle
  • Support engineers from Development, Quality, and Reliability groups in finding root causes and solutions to thermomechanical microelectronic assembly issues (adhesion, delamination, process optimization, failure source control, etc.)

Benefits

  • general: Opportunity to learn and develop career
  • general: Encouragement to be courageous and experiment daily
  • general: Continuous trust and support in an inclusive environment
  • general: Growth-minded culture with openness to feedback and learning
  • general: Collaboration with colleagues for team-focused outcomes
  • general: Equal-opportunity employment without discrimination

Target Your Resume for "Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique" , IBM

Get personalized recommendations to optimize your resume specifically for Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique. Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "Scientifique en modélisation thermomécanique et en science des matériaux appliquée à la microélectronique" , IBM

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Tags & Categories

Infrastructure & TechnologyInfrastructure & Technology

Related Jobs You May Like

No related jobs found at the moment.