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Embedded Design Engineering Intern – Firmware - Careers at Leidos

Leidos

Embedded Design Engineering Intern – Firmware - Careers at Leidos

internshipPosted: Feb 3, 2026

Job Description

Launch Your Embedded Engineering Career at Leidos

Leidos Defense Systems seeks a driven Embedded Design Engineering Intern – Firmware to join our Huntsville, AL team. Dive into real-world challenges in defense, space, and cyber solutions. Our 20+ year internship program delivers unmatched hands-on experience, mentorship, and growth in a fast-paced, innovative environment.

Primary Responsibilities

  • Develop embedded software and firmware for cutting-edge systems
  • Execute HDL simulations, software unit tests, and verification
  • Perform laboratory testing using advanced instrumentation and debug techniques
  • Collaborate with cross-functional teams on complex engineering projects
  • Engage with FPGAs, microcontrollers, microprocessors, and mixed-signal platforms

Basic Qualifications

  • Enrolled in accredited Computer Engineering or related program
  • Proven C, C++, or Rust experience from coursework, labs, or internships
  • GPA 3.0+ with strong problem-solving, teamwork, and communication
  • US Citizen able to obtain/maintain DoD Secret clearance
  • Submit resume and unofficial transcripts

Preferred Qualifications

Stand out with:

  • Xilinx FPGA/SoC expertise (RFSoC, AXI4/Stream, IP Cores)
  • FPGA languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
  • Simulation/test frameworks and RISC architectures (ARM, RISC-V)
  • Memory systems, GNU/Linux kernel drivers, protocols (UART, Ethernet, CAN)
  • RTOS experience (FreeRTOS, Zephyr), electronics/PCBA design

Why Leidos?

Experience full product lifecycle from concept to support. Gain skills in DSP, PCB design, trade studies. Thrive where disruptors outpace the status quo. Pay Range: $48,100 - $86,950 USD (factors include education, skills, market data).

Join Leidos: Outthink. Outbuild. Outpace.

Locations

  • Huntsville, Alabama, United States

Salary

48,100 - 86,950 USD / yearly

Estimated Salary Rangehigh confidence

48,100 - 86,950 USD / yearly

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • C/C++ embedded programmingintermediate
  • Rust programmingintermediate
  • HDL (VHDL/Verilog/SystemVerilog)intermediate
  • FPGA design (Xilinx RFSoC, AXI4)intermediate
  • Embedded Linux/kernel driversintermediate
  • Communication protocols (UART, SPI, I2C, Ethernet)intermediate

Required Qualifications

  • Currently enrolled in Computer Engineering or related degree program (experience)
  • GPA 3.0 or higher (experience)
  • Experience with C/C++/Rust through coursework/projects (experience)
  • US Citizen eligible for DoD Secret clearance (experience)
  • Strong problem-solving, teamwork, communication skills (experience)

Responsibilities

  • Design embedded software and firmware
  • Perform HDL simulations and software unit tests
  • Conduct hands-on lab testing with instrumentation and debug methods
  • Collaborate in multi-disciplinary engineering teams
  • Work with FPGAs, microcontrollers, microprocessors, mixed-signal designs

Benefits

  • general: Hands-on experience across product lifecycle
  • general: Learning opportunities in DSP/PCB design and trade studies
  • general: Leadership and technical growth in defense/aerospace
  • general: Exposure to cutting-edge Xilinx FPGA/SoC technologies
  • general: Mentorship in collaborative, innovative environment

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Jobs in Huntsville ALLeidos CareersEngineering InternshipsDefense Jobs United StatesFPGA FirmwareEngineeringInformation TechnologySecurity

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Leidos logo

Embedded Design Engineering Intern – Firmware - Careers at Leidos

Leidos

Embedded Design Engineering Intern – Firmware - Careers at Leidos

internshipPosted: Feb 3, 2026

Job Description

Launch Your Embedded Engineering Career at Leidos

Leidos Defense Systems seeks a driven Embedded Design Engineering Intern – Firmware to join our Huntsville, AL team. Dive into real-world challenges in defense, space, and cyber solutions. Our 20+ year internship program delivers unmatched hands-on experience, mentorship, and growth in a fast-paced, innovative environment.

Primary Responsibilities

  • Develop embedded software and firmware for cutting-edge systems
  • Execute HDL simulations, software unit tests, and verification
  • Perform laboratory testing using advanced instrumentation and debug techniques
  • Collaborate with cross-functional teams on complex engineering projects
  • Engage with FPGAs, microcontrollers, microprocessors, and mixed-signal platforms

Basic Qualifications

  • Enrolled in accredited Computer Engineering or related program
  • Proven C, C++, or Rust experience from coursework, labs, or internships
  • GPA 3.0+ with strong problem-solving, teamwork, and communication
  • US Citizen able to obtain/maintain DoD Secret clearance
  • Submit resume and unofficial transcripts

Preferred Qualifications

Stand out with:

  • Xilinx FPGA/SoC expertise (RFSoC, AXI4/Stream, IP Cores)
  • FPGA languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
  • Simulation/test frameworks and RISC architectures (ARM, RISC-V)
  • Memory systems, GNU/Linux kernel drivers, protocols (UART, Ethernet, CAN)
  • RTOS experience (FreeRTOS, Zephyr), electronics/PCBA design

Why Leidos?

Experience full product lifecycle from concept to support. Gain skills in DSP, PCB design, trade studies. Thrive where disruptors outpace the status quo. Pay Range: $48,100 - $86,950 USD (factors include education, skills, market data).

Join Leidos: Outthink. Outbuild. Outpace.

Locations

  • Huntsville, Alabama, United States

Salary

48,100 - 86,950 USD / yearly

Estimated Salary Rangehigh confidence

48,100 - 86,950 USD / yearly

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • C/C++ embedded programmingintermediate
  • Rust programmingintermediate
  • HDL (VHDL/Verilog/SystemVerilog)intermediate
  • FPGA design (Xilinx RFSoC, AXI4)intermediate
  • Embedded Linux/kernel driversintermediate
  • Communication protocols (UART, SPI, I2C, Ethernet)intermediate

Required Qualifications

  • Currently enrolled in Computer Engineering or related degree program (experience)
  • GPA 3.0 or higher (experience)
  • Experience with C/C++/Rust through coursework/projects (experience)
  • US Citizen eligible for DoD Secret clearance (experience)
  • Strong problem-solving, teamwork, communication skills (experience)

Responsibilities

  • Design embedded software and firmware
  • Perform HDL simulations and software unit tests
  • Conduct hands-on lab testing with instrumentation and debug methods
  • Collaborate in multi-disciplinary engineering teams
  • Work with FPGAs, microcontrollers, microprocessors, mixed-signal designs

Benefits

  • general: Hands-on experience across product lifecycle
  • general: Learning opportunities in DSP/PCB design and trade studies
  • general: Leadership and technical growth in defense/aerospace
  • general: Exposure to cutting-edge Xilinx FPGA/SoC technologies
  • general: Mentorship in collaborative, innovative environment

Target Your Resume for "Embedded Design Engineering Intern – Firmware - Careers at Leidos" , Leidos

Get personalized recommendations to optimize your resume specifically for Embedded Design Engineering Intern – Firmware - Careers at Leidos. Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "Embedded Design Engineering Intern – Firmware - Careers at Leidos" , Leidos

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Tags & Categories

Jobs in Huntsville ALLeidos CareersEngineering InternshipsDefense Jobs United StatesFPGA FirmwareEngineeringInformation TechnologySecurity

Answer 10 quick questions to check your fit for Embedded Design Engineering Intern – Firmware - Careers at Leidos @ Leidos.

Quiz Challenge
10 Questions
~2 Minutes
Instant Score

Related Books and Jobs

No related jobs found at the moment.