RESUME AND JOB
Northrop Grumman
Assisting with ongoing efforts to integrate in-line defect metrology into our process flows Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 6 months+ of relevant experience. Hands on experience with Si, GaAs, or other wafers. Ability to work in a cleanroom setting. Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule. U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required. Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years of relevant experience General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes). General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. Basic knowledge of statistical process control. Hands on experience with Si, GaAs, or other wafers. Ability to work in a cleanroom setting. Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule. Hands on knowledge and operation of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes). Hands on knowledge and operation of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. Experience in lean manufacturing practices and structured problem-solving methodology. Experience working in a cleanroom setting. 1 year experience with semiconductor fabrication. Data analysis and visualization (JMP). Experience developing technical specifications for equipment procurement. Active Secret clearance.
90,000 - 150,000 USD / yearly
Source: rule based estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Get personalized recommendations to optimize your resume specifically for Characterization Fab Engineer Level 1 or 2 (2nd shift). Takes only 15 seconds!
Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.
Answer 10 quick questions to check your fit for Characterization Fab Engineer Level 1 or 2 (2nd shift) @ Northrop Grumman.

No related jobs found at the moment.

© 2026 Pointers. All rights reserved.

Northrop Grumman
Assisting with ongoing efforts to integrate in-line defect metrology into our process flows Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 6 months+ of relevant experience. Hands on experience with Si, GaAs, or other wafers. Ability to work in a cleanroom setting. Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule. U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required. Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years of relevant experience General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes). General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. Basic knowledge of statistical process control. Hands on experience with Si, GaAs, or other wafers. Ability to work in a cleanroom setting. Ability to work 2nd shift hours (3PM-12AM Mon-Fri) and work either 5x8 or 9/80B schedule. Hands on knowledge and operation of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes). Hands on knowledge and operation of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools. Experience in lean manufacturing practices and structured problem-solving methodology. Experience working in a cleanroom setting. 1 year experience with semiconductor fabrication. Data analysis and visualization (JMP). Experience developing technical specifications for equipment procurement. Active Secret clearance.
90,000 - 150,000 USD / yearly
Source: rule based estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Get personalized recommendations to optimize your resume specifically for Characterization Fab Engineer Level 1 or 2 (2nd shift). Takes only 15 seconds!
Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.
Answer 10 quick questions to check your fit for Characterization Fab Engineer Level 1 or 2 (2nd shift) @ Northrop Grumman.

No related jobs found at the moment.

© 2026 Pointers. All rights reserved.