Strategic Thinking:

Aligns contract strategy with fab productivity goals. Problem Solving:

Quickly isolates root causes and drives corrective actions. Stakeholder Management:

Balances vendor interests with internal operational priorities. Data‑Driven:

Leverages KPI trends to make informed decisions and forecast renewal needs. Integrity:

Maintains confidentiality of proprietary equipment data and contract terms. Bachelor's degree in a STEM discipline (Science, Technology, Engineering, or Math) with 2 years of related experience; Master's degree in a STEM discipline with 0 years related experience; Experience contributing to CI projects designed to improve equipment performance and reliability and to maximize Mean Productive Time Between Failures (MTBF). Bachelor's degree in a STEM discipline (Science, Technology, Engineering, or Math) with 5 years of related experience; Master's degree in a STEM discipline with 3 years related experience; Ph.D in a STEM discipline with 1 year of related experience. Prior experience in generating standard operating procedures (SOPs), technical reports, and corrective and preventive maintenance plans for 200mm or 300mm semiconductor equipment. Experience contributing to CI projects designed to improve equipment performance and reliability and to maximize Mean Productive Time Between Failures (MTBF). Excellent analytical and problem-solving skills, with the ability to work both independently and collaboratively in a team environment. Prior experience coordinating or instructing field service engineers (FSEs) from leading semiconductor OEMs (e.g., AMAT, ASML, KLA, Onto, Raith). Strong understanding of wafer fabrication processes (etch, deposition, lithography, metrology, etc.). Experience negotiating and managing service contracts with leading semiconductor OEMs. Proficiency in data analysis, SPC, and root cause methodologies (e.g., 8D). Advanced communication and negotiation skills, with the ability to convey complex technical concepts clearly and negotiate mutually beneficial agreements. Skill in interpreting and modifying diagrams and schematics to troubleshoot and resolve hardware issues effectively. Expertise in fingerprinting a wide range of equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables. Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs.