- Bachelor of Science degree in Mechanical or Aerospace Engineering with a minimum of 2 years of experience in electronics packaging or a Master's degree in Mechanical or Aerospace Engineering - Extensive experience with hardware development and electro-mechanical packaging, including at least one of the following subjects: thermal analysis, structural analysis, microelectronics design, opto-mechanical design, environmental testing - Proficiency with 3D CAD Tools (Siemens NX is preferred) and product data management tools - Demonstrated leadership of small to moderately sized teams during the product development process including the review of technical work products - Demonstrated application of innovative solutions to complex problems that arise within the design, development, and production phases- - Strong written, verbal and interpersonal communication skills including experience presenting at design reviews and customer/stakeholder briefings - Displayed ability to exercise latitude in determining most appropriate technical approach of assignments - U. S. citizen - Ability to obtain and maintain a minimum of a Secret Clearance with additional customer specified clearance prior to start. ​ - Master of Science degree in Mechanical or Aerospace Engineering - Expertise with ANSYS and/or other tools used for design analysis - Familiarity with opto-mechanical engineering - Working knowledge of military and commercial process specifications - Proficiency in geometric dimensioning and tolerancing - Demonstrated success leading others within an integrated product team (IPT), supporting the development of junior engineers and cross functional collaboration for overall project success - Experience with project management metrics, including earned value management, to monitor and manage engineering budget and schedule requirements - Experience in design, manufacturing, and integration of electronic assemblies including appropriate material selections and use of off the shelf components - Experience contributing to technical and cost proposal development - Leadership in process improvement or knowledge transfer (i.e. publication) activities Primary Level Salary Range: $77,600.00 - $116,400.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.