Run fabrication equipment for processing semiconductor materials and devices under the guidance of process documentation which includes the set-up and operation of a variety of standard and special solid-state processing equipment. This includes performing various chemical, physical, photographic, and packaging processes such as deposition, evaporations, and etching of materials, metals plating, wafer dicing /thinning, and making/requesting adjustments based upon the knowledge of process and procedures, and monitoring equipment when applicable. Examine processes such as resist/develop processing, photo exposure, metallization, and etching to determine the quality of the process to locate defects. Determine and discuss with the engineer possible improvements in process or equipment to remedy defects. Interpret SPC (Statistical Process Control) charts to react to out-of-control conditions to maintain process control. Prepare reports or parts of reports following established patterns. Covering assignments such as preparing masks, operating photographic equipment, and developing photographic requirements. Placing lots on hold, based on engineering guidance, disposition lots, and document in MES. Performing tasks such as running split lots for engineering and ensuring special processing is consistent and on time. Performing gage R&R (Repeatable & Reproducibility) studies for metrology equipment. Will train on 1st shift and transition to second shift when training is complete. When on the 2nd shift there is receive a shift premium of 10%. Flexibility to work 1st shift as needed. Must have the ability to lift, hold, move, and manipulate the wafers in a FOUP (Front Opening Unified Pod) to 25 pounds and with a wand as applicable. High school graduate or recognized equivalent. Associate degree or two years (minimum 60 semester hours) of college-level study with a major in physical science or equivalent; or 2 years of relevant experience. 2 years prior manufacturing experience or 1 year of semiconductor (cleanroom) manufacturing experience The ability to obtain and maintain a Department of Defense (DoD) Secret clearance. U.S. citizenship Required Experience running semiconductor process equipment and metrology equipment. Experience in data collection and interpretation. Wafer handling experience, placing lots on hold, and disposition of held material. Security Clearance.