Ensure all metal equipment is properly qualified and calibrated. Develop new technologies across the portfolio of emerging technologies in semiconductor wafer-level interconnect manufacturing on multiple wafer sizes. Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out-of-spec material. Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics. Adhere to all safety regulations and protocols to maintain a safe working environment. Collaborate and drive continuous improvement projects with both equipment vendors and materials suppliers. Support capital equipment projects through procurement, installation, and release for production use Coordinates with production on day-to-day activities. Assists in the resolution of production workflow issues. Support engineering data analysis, including metrology data, ERP and MES data, and other in-process metrics BS Degree in Materials Science, or a related STEM field with a minimum of (5) years of Semiconductor Metals (PVD) and/or Alloys experience, or (3) years with a master's, or (0) years with a PhD Proficiency in semiconductor PVD process control and process development Proficiency in process set-up, optimization, and troubleshooting for PVD, plasma clean, and bumping toolsets Strong understanding of vacuum technology, thin-film stress, adhesion, uniformity, and contamination control Experience with under bump metallurgy, and optimizing plasma parameters (RF power, gas chemistry, pressure, bias, time) to achieve residue-free surfaces. Experience fabricating a wide variety of interconnect technologies and metals, including lead and lead-free solders and other metal systems. Experience in a production manufacturing environment Experience in Design of Experiment (DOE), Statistical Process Control (SPC), and 6 sigma concepts for process development and control Experience in conducting FMEA analyses of processes and equipment Experience in technical data collection, organization, and analysis skills Proficient in data analysis techniques/programs Familiarity with Enterprise Resource Planning and Manufacturing Execution Systems US Citizenship is required The ability to obtain a DOD Secret Clearance is required Experience with JMP, MATLAB, VBA, and/or similar Expert in 8D Problem Solving Experience with CAD software (AutoCAD, NX, or similar) Experience with Minitab software Experience with SAP MRP software Strong integration skillset across lithography, plasma descum, wet cleans, electroplating, etch, AOI, and reflow Characterize surface cleanliness using SEM, FTIR, ellipsometry, contact angle, and XPS Experience in flip-chip, 2.5D, and 3D packaging Active Secret Clearance or Higher Six Sigma Blackbelt Certification