Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing. Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints. Providing technical leadership and mentoring to less experienced personnel. Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs At Northrop Grumman, we are committed to maintaining the highest of ethical standards, embracing diversity and inclusion, protecting the environment, and striving to be an ideal corporate citizen in the community and in the world. Primary Level Salary Range: $105,400.00 - $158,000.00 Secondary Level Salary Range: $131,100.00 - $196,700.00 The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates. Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions. Bachelor's degree with 5 years of experience, a master's degree with 3 years of experience or a PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substratePWB layout Proficient with AutoCAD and/or Xpedition software Bachelor's degree with 8 years of experience, a master's degree with 6 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement. U.S Citizenship is required. The ability to obtain/maintain a DoD Active Secret clearance. A current/active clearance is not required to be considered for the position, but a final clearance is required to start Experience with PWB/CCA design and signal routing, including chip-scale packaging technologies and substratePWB layout Proficient with AutoCAD and/or Xpedition software Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. A current/active DoD Secret Clearance or higher Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices Familiarity with thermal and structural analysis considerations, methodologies, and software tools Experience with hands-on assembly and testing of prototype electronic hardware Experience in a technical leadership role on a cross-functional product development team Experience routing RF signals