Performance is expected in a fast-paced work environment with high expectations, significantly diverse assignments, and collaborative/team settings. Provide or present I&T tests and/or plans, activities or status at program technical reviews or other technical meetings Develop I&T Verification and Validation matrices of processing subsystem, board designs and FPGA logic designs based on compliance requirements, and supporting validation at the component, board and subsystem levels Design, develop, creation and modification of Electric Ground Support Equipment (EGSE) in other words test set required for I&T activities Lead and direct engineering teams during integration & test of digital subsystems and products Design, develop, creation and modification of test scripts utilizing (FPGAs) Xilinx and Microchip FPGAs Responsible for Planning, executing, and overseeing the integration and test activities for Payload Support Electronics (PSE). Ensures the PSE meets performance, functional, interface and requirements before delivery to Payload level. Develop PSE integration plan and procedures. Coordinating with ECA designers and systems to ensure test readiness Manage integration of HW/SW and FW at the PSE level Bachelor's degree in engineering or STEM-related discipline with 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD) Experience with the use of various FPGAs or the development of HDL (Verilog and VHDL) code within the corresponding Integrated Development Environment (IDE) Experience as technical lead or other similar leadership role with demonstrated team building, organizational, and interpersonal skills Experience translating customer requirements and/or functional block diagrams into realized I&T test plans, procedures or test scripts. Fluency with developing and executing technical development plans Basic understanding of the Design, Manufacturing, and Test process Problem-solving experience in a team environment Active TS/SCI Digital test and Digital test requirements development experience Deep technical skills covering subsystem (box/LRU level), ASIC, FPGA and/or board design and troubleshooting skills Embedded networking or high-speed protocols experience (Ethernet, PCIe, Interlaken, InfiniBand, etc.) Demonstrated ability to analyze and troubleshoot RF subsystems, complex mixed-signal ECAs and RF modules using schematics, component design documents, and basic lab test equipment. Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty. Basic understanding of the Design, Manufacturing, and Test process. Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA) Interest in mentoring/teaching/growing junior engineers Some signal processing familiarity Experience with scripting languages such as TCL, Python or Perl Experience Integrating a system containing digital hardware, software and firmware Ability to multi-task and apply good time management