Packaging Process Leadership:

Own end-to-end packaging flows, including wafer prep, laser dicing, die attach (eutectic and epoxy), pick-and-place, wire bonding, hermetic encapsulation, seam sealing, and tape-and-reel. Mission Assurance:

Ensure all packaging processes meet MIL-STD, NASA, JEDEC, and customer specifications for high-reliability applications, including Class K space hardware. Integration & Strategy:

Provide a system-level perspective of how packaging processes interact and impact device performance, yield, and long-term reliability. Drive design-for-packaging into product development lifecycles. Technical Authority:

Serve as a subject matter expert (SME) in packaging for internal teams, customer reviews, and external audits. Provide technical guidance in supplier evaluations, tool procurements, and process qualifications. Problem Solving & Improvement:

Lead root cause investigations on complex yield and reliability challenges. Direct corrective and preventive actions across the packaging value stream. Innovation & Capability Growth:

Identify and champion new packaging technologies, equipment, and methodologies to improve manufacturability, throughput, and reliability. Collaboration & Mentorship:

Partner with design engineering, reliability, operations, and program management teams. Mentor junior engineers and technicians to grow organizational capability in advanced packaging. Documentation & Compliance:

Author and review technical documentation, including process travelers, work instructions, and qualification reports to ensure compliance with customer and regulatory standards. Bachelor's degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field and 8+ years of experience in microelectronics packaging, or 6+ years with a Master's degree, or 4+ years with a PhD. Hands-on and leadership experience with eutectic die attach, thermosonic wire bonding (Au/Al), hermetic encapsulation/seam sealing, and laser dicing along with the demonstrated ability to analyze packaging yield data, drive process improvements, and lead corrective actions. Strong understanding of high-reliability manufacturing standards (MIL-STD-883, MIL-PRF-38535, NASA/ESA packaging guidelines). Experience working in a production or manufacturing environment and generating specifications for procurement of new equipment. Develop manufacturing processes, work instructions and production layouts required to fabricate the product. Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process. Respond to design and specification changes by capturing details into the manufacturing process. Analyze yield and scrap rate data to aid in improving processes. Proven ability to lead cross-functional teams, interface with customers, and act as a technical authority. Active or ability to obtain a U.S. DoD Secret clearance. Master's or PhD in Mechanical Engineering, Materials Science, or related discipline. 12+ years of experience in semiconductor/microelectronics packaging for space, defense, or medical devices. Knowledge of mechanical manufacturing and production processes. Respond to technical production issues associated with the product being fabricated. Analyze processes and equipment for process capabilities and downtime. Familiarity with hermeticity testing (helium fine/gross leak), destructive physical analysis, and long-term reliability qualification. Experience applying SPC, DOE, FMEA, and Lean Six Sigma methodologies in packaging environments. Direct experience with supplier oversight, equipment qualification, and government/customer audits. Recognized as a Subject Matter Expert (SME) in packaging for aerospace/defense programs. Demonstrated leadership in advancing packaging capabilities and mentoring engineering talent.