RESUME AND JOB
Northrop Grumman
Process Development & Control:
Develop and optimize manufacturing processes, including wafer- and die-level AOI, pick-and-place assembly, tape-and-reel packaging, and final product handling. Analyze inspection data to detect patterns, trends, and opportunities for corrective actions. Support the integration of automated equipment and collaborate with vendors for equipment troubleshooting and upgrades. Bachelor's Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 8+ years of relevant experience; Master's Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 6+ years of relevant experience or 4+ years of experience with a PhD. Hands-on experience with wafer-level and die-level Automated Optical Inspection (AOI) systems. Familiarity with tape-and-reel packaging processes and JEDEC packaging standards. Ability to read and interpret 2D drawings and technical specifications. Knowledge of ESD, MSL, and cleanroom handling practices. Experience working in a production or manufacturing environment. Develop manufacturing processes, work instructions and production layouts required to fabricate the product. Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process. Respond to design and specification changes by capturing details into the manufacturing process. Respond to technical production issues associated with the product being fabricated. Generate specifications for procurement of new equipment. Analyze yield and scrap rate data to aid in improving processes. Experience with working on automation equipment and/or machinery. Master's degree in Mechanical, Manufacturing, or Electrical Engineering. 5+ years of experience in semiconductor packaging, assembly, or microelectronics manufacturing. Experience developing manufacturing work instructions and process documentation. Familiarity with SPC (Statistical Process Control), FMEA, and Lean Six Sigma methodologies. Assist in establishing safety requirements for facilities and equipment. Proven ability to analyze yield, scrap rate, and downtime data to drive continuous improvement. Demonstrated experience working in cross-functional teams to resolve production issues. Experience with automated pick-and-place assembly equipment. Experience interfacing with equipment vendors or troubleshooting and process upgrades. Proven technical leadership experience. Work as part of an Integrated Product Team to support both internal and external customers. Work in a multifunctional team to solve production related issues. Work with maintenance staff or vendors to troubleshoot and repair production specific equipment. Analyze processes and equipment for process capabilities and downtime. Proven track record of implementing process automation and efficiency improvements. Strong technical leadership experience with the ability to mentor junior engineers or technicians. Experience in lean manufacturing practices and structured problem-solving methodology Experience working in semiconductor or microelectronics fab. Experience developing technical specifications for process material procurement Experience developing technical specifications for equipment procurement Active Secret clearance
125,000 - 185,000 USD / yearly
Source: rule based estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
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Northrop Grumman
Process Development & Control:
Develop and optimize manufacturing processes, including wafer- and die-level AOI, pick-and-place assembly, tape-and-reel packaging, and final product handling. Analyze inspection data to detect patterns, trends, and opportunities for corrective actions. Support the integration of automated equipment and collaborate with vendors for equipment troubleshooting and upgrades. Bachelor's Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 8+ years of relevant experience; Master's Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 6+ years of relevant experience or 4+ years of experience with a PhD. Hands-on experience with wafer-level and die-level Automated Optical Inspection (AOI) systems. Familiarity with tape-and-reel packaging processes and JEDEC packaging standards. Ability to read and interpret 2D drawings and technical specifications. Knowledge of ESD, MSL, and cleanroom handling practices. Experience working in a production or manufacturing environment. Develop manufacturing processes, work instructions and production layouts required to fabricate the product. Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process. Respond to design and specification changes by capturing details into the manufacturing process. Respond to technical production issues associated with the product being fabricated. Generate specifications for procurement of new equipment. Analyze yield and scrap rate data to aid in improving processes. Experience with working on automation equipment and/or machinery. Master's degree in Mechanical, Manufacturing, or Electrical Engineering. 5+ years of experience in semiconductor packaging, assembly, or microelectronics manufacturing. Experience developing manufacturing work instructions and process documentation. Familiarity with SPC (Statistical Process Control), FMEA, and Lean Six Sigma methodologies. Assist in establishing safety requirements for facilities and equipment. Proven ability to analyze yield, scrap rate, and downtime data to drive continuous improvement. Demonstrated experience working in cross-functional teams to resolve production issues. Experience with automated pick-and-place assembly equipment. Experience interfacing with equipment vendors or troubleshooting and process upgrades. Proven technical leadership experience. Work as part of an Integrated Product Team to support both internal and external customers. Work in a multifunctional team to solve production related issues. Work with maintenance staff or vendors to troubleshoot and repair production specific equipment. Analyze processes and equipment for process capabilities and downtime. Proven track record of implementing process automation and efficiency improvements. Strong technical leadership experience with the ability to mentor junior engineers or technicians. Experience in lean manufacturing practices and structured problem-solving methodology Experience working in semiconductor or microelectronics fab. Experience developing technical specifications for process material procurement Experience developing technical specifications for equipment procurement Active Secret clearance
125,000 - 185,000 USD / yearly
Source: rule based estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Get personalized recommendations to optimize your resume specifically for Sr Principal Process Engineer Microelectronics. Takes only 15 seconds!
Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

No related jobs found at the moment.
© 2026 Pro Partners. All rights reserved.