Solve complex technical issues with limited supervision Mechanical design and packaging of special test equipment (STE) antenna, RF, digital, infrastructure, and test hardware products, including avionics modules, racks, and interface test adapters. Perform thermal and structural analyses as required. Support electrical-mechanical tradeoffs and physical verification and qualification testing for new designs, as required. Mentor & lead jr. electromechanical engineers Bachelor of Science (BS) degree in Mechanical/Aerospace Engineering or closely related STEM field with a minimum of 12 years related experience; OR 10 years related experience with a Masters (MS) degree in STEM. 9 years with a PhD CLEARANCE:

Active TS/SCI required at the time of application to be considered. Experience with electronics packaging design, including special test equipment (STE) design, CAD modeling techniques, and thermal/structural analysis methods. Proficiency in relevant CAD software. Effective verbal and written communication skills. Capable of designing to a hardware requirements specification. Demonstrated understanding of mechanical design principles and techniques. Demonstrated success working individually or as part of a team requiring little supervision. Hardware Lead experience leading a multi-disciplinary team of mechanical/electrical engineers CAM/EVMS Certification or CAM/EVMS experience Experience driving preliminary/critical design reviews for mechanical and electrical designs Experience working with Global Supply Chain (GSC) Proposal Lead and BOE writing experience