Lead process and/or equipment engineering efforts utilizing Applied Materials tools, a combination of ENDURA, CENTURA (dry etch and CVD) and MIRRA platforms. This position will focus on driving process optimization and enhancing equipment performance by collaborating with on-site AMAT FSO and engineering functions. In this role you will focus on improving various operational metrics, including:

Process capability (CpK) Equipment availability Tool down escalations Maintenance ratio (M-ratio) Mean Time to Repair (MTTR) Mean Time Between Failures (MTBF) Preventive Maintenance (PM) success rate PM on-time and in-time metrics Provide informal guidance to process and equipment engineers while collaborating and directing Customer Engineers (CEs) in both conference room and hands-on settings. Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals and process Best Known Methods (BKMs). Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders such as Operations, Process Engineering, Equipment Engineering, and site director. Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency. Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment malfunctions. Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools. Bachelor's degree in a STEM discipline (Science, Technology, Engineering, or Math) and 12+ years of related experience; or Master's degree in a STEM discipline and 10 years of related experience. Prior experience with leading OEMs and/or HVM fabs. Proven expertise with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms. Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment. Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement. Able to create and perform equipment and process partitioning to resolve hardware and/or process issues, such as failing mechanical and infilm defects, high film uniformity, failing VPD, and more. Skilled in interpreting and modifying diagrams and schematics to effectively troubleshoot and resolve hardware issues. US citizenship and ability to obtain and maintain a DoD Top Secret/SCI clearance with Poly required. Expertise in fingerprinting a wide range of Applied Materials equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables. Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs. Expertise in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput. Expertise in Centura etch eMXP+ systems, specializing in high-aspect-ratio etches on silicon, metal, and dielectrics. Expertise in Centura CVD platforms to deposit high quality SIOx and SiN films, including modifying hardware and/or process. Expertise in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing, expertise in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning.