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Senior Package Layout Engineer

NVIDIA

Engineering Jobs

Senior Package Layout Engineer

full-timePosted: Sep 5, 2025

Job Description

NVIDIA have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our exclusive engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.What you'll be doing:As part of a Package Layout team, you will collaborate to implement high speed and PDN design for ASIC packages.Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using APD or SiP tools.Optimize package pin out incorporating system level trade-offs of pins assignment.Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.In close co-operation with the SI/PI/HW design teams and product teamsPlanning, ensuring stakeholder management and leading projects from start to finishWhat we need to see:B.Sc. Electrical Engineering or any equivalent experience.Minimum of 5+ years hand-on in Package or/and PCB Layout; including high speed design signal integrity practice; PDN designing and planningExperience in substrate layout of wire bond and flip chip packages, preferredKnowledge in substrates or board manufacturing processSignificant background with APD or SiP and/or other PCB layout toolsEnglish communication skills (written and verbal) are required for this roleWays to stand out from the crowd:Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation toolsFamiliarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)We are committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Locations

  • Hsinchu, Taiwan

Salary

Estimated Salary Rangemedium confidence

4,500,000 - 9,000,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • IC Packaging Designintermediate
  • High-Speed Interconnect Systemsintermediate
  • PDN Designintermediate
  • ASIC Packagesintermediate
  • Substrate Package Routingintermediate
  • Placementintermediate
  • Stack-upintermediate
  • Reference Planeintermediate
  • Power Distributionintermediate
  • APD Toolsintermediate
  • SiP Toolsintermediate
  • Pin Out Optimizationintermediate
  • System Level Trade-offsintermediate
  • Layout Methodologiesintermediate
  • SI/PI/HW Designintermediate
  • Stakeholder Managementintermediate
  • Project Leadershipintermediate
  • Package Layoutintermediate
  • PCB Layoutintermediate
  • High Speed Designintermediate
  • Signal Integrityintermediate
  • Wire Bond Packagesintermediate
  • Flip Chip Packagesintermediate
  • Substrates Manufacturing Processintermediate
  • Board Manufacturing Processintermediate
  • Ansys SIwaveintermediate
  • Ansys HFSSintermediate
  • Cadence Sigrityintermediate
  • Cadence PowerSIintermediate
  • Skill Language (Cadence)intermediate
  • Parsing Abilitiesintermediate
  • English Communicationintermediate

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NVIDIA logo

Senior Package Layout Engineer

NVIDIA

Engineering Jobs

Senior Package Layout Engineer

full-timePosted: Sep 5, 2025

Job Description

NVIDIA have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our exclusive engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.What you'll be doing:As part of a Package Layout team, you will collaborate to implement high speed and PDN design for ASIC packages.Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using APD or SiP tools.Optimize package pin out incorporating system level trade-offs of pins assignment.Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.In close co-operation with the SI/PI/HW design teams and product teamsPlanning, ensuring stakeholder management and leading projects from start to finishWhat we need to see:B.Sc. Electrical Engineering or any equivalent experience.Minimum of 5+ years hand-on in Package or/and PCB Layout; including high speed design signal integrity practice; PDN designing and planningExperience in substrate layout of wire bond and flip chip packages, preferredKnowledge in substrates or board manufacturing processSignificant background with APD or SiP and/or other PCB layout toolsEnglish communication skills (written and verbal) are required for this roleWays to stand out from the crowd:Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation toolsFamiliarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)We are committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

Locations

  • Hsinchu, Taiwan

Salary

Estimated Salary Rangemedium confidence

4,500,000 - 9,000,000 INR / yearly

Source: ai estimated

* This is an estimated range based on market data and may vary based on experience and qualifications.

Skills Required

  • IC Packaging Designintermediate
  • High-Speed Interconnect Systemsintermediate
  • PDN Designintermediate
  • ASIC Packagesintermediate
  • Substrate Package Routingintermediate
  • Placementintermediate
  • Stack-upintermediate
  • Reference Planeintermediate
  • Power Distributionintermediate
  • APD Toolsintermediate
  • SiP Toolsintermediate
  • Pin Out Optimizationintermediate
  • System Level Trade-offsintermediate
  • Layout Methodologiesintermediate
  • SI/PI/HW Designintermediate
  • Stakeholder Managementintermediate
  • Project Leadershipintermediate
  • Package Layoutintermediate
  • PCB Layoutintermediate
  • High Speed Designintermediate
  • Signal Integrityintermediate
  • Wire Bond Packagesintermediate
  • Flip Chip Packagesintermediate
  • Substrates Manufacturing Processintermediate
  • Board Manufacturing Processintermediate
  • Ansys SIwaveintermediate
  • Ansys HFSSintermediate
  • Cadence Sigrityintermediate
  • Cadence PowerSIintermediate
  • Skill Language (Cadence)intermediate
  • Parsing Abilitiesintermediate
  • English Communicationintermediate

Target Your Resume for "Senior Package Layout Engineer" , NVIDIA

Get personalized recommendations to optimize your resume specifically for Senior Package Layout Engineer. Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "Senior Package Layout Engineer" , NVIDIA

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Tags & Categories

Taiwan

Answer 10 quick questions to check your fit for Senior Package Layout Engineer @ NVIDIA.

Quiz Challenge
10 Questions
~2 Minutes
Instant Score

Related Books and Jobs

No related jobs found at the moment.