Overview

Oracle is seeking a skilled Hardware Developer 4 to lead the deployment and management of direct-to-chip liquid cooling technology with external manufacturing partners in the United States. The successful candidate will ensure robust technical implementation, drive quality standards, and oversee supplier collaboration. This role supports the innovation of advanced thermal management solutions for Oracle's cutting-edge hardware.

Responsibilities

• Lead deployment of direct-to-chip liquid cooling systems with external manufacturing partners.
• Manage end-to-end technical implementation and integration of cooling technologies.
• Drive quality standards and rigorous testing protocols for hardware reliability.
• Oversee supplier collaboration, including performance reviews and issue resolution.
• Develop and optimize thermal management solutions for high-performance computing.
• Coordinate cross-functional teams to align on project timelines and deliverables.
• Support innovation initiatives for next-generation cooling architectures.
• Monitor production scalability and provide technical guidance to partners.

Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field; Master's preferred.
• 8+ years of experience in hardware development, focusing on thermal management or liquid cooling.
• Proven track record leading projects with external manufacturing partners.
• Strong knowledge of direct-to-chip cooling technologies and industry standards.
• Excellent problem-solving skills and experience with quality assurance processes.
• Ability to travel domestically as needed for supplier engagements.

Benefits

• Competitive base salary and performance-based incentives.
• Comprehensive health, dental, and vision insurance coverage.
• 401(k) retirement savings plan with company match.
• Generous paid time off and flexible work arrangements.
• Professional development opportunities and tuition reimbursement.