About Samsung Austin SemiconductorSamsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At SAS, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us!Position SummarySamsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintains detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24 / 7 wafer bonding operation.Role and ResponsibilitiesEquipment Setup and OperationPrepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirementsEnsure tool to tool matching across fabs and between toolsDevelop and maintain Preventative Maintenance schedules and proceduresEnsure bonding meets device and process output specificationsSuccessfully transfer and qualify process from development fab to HVM facilityTechnical TroubleshootingInvestigate wafer bonding issues, create troubleshooting plans, and apply corrective action plansProvide clear updates and instructions to users and management regarding ongoing issues and resolutionsMaintain FMEA and manage RPN reduction activityEquipment and Process Continuous ImprovementLead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughputCollaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques. Talent DevelopmentProviding technical support and training to operators and technicians on equipment operation and proceduresPresent key technical developments to SAS technical staff and management Skills and QualificationsRequired / Strongly Desired Knowledge/Skills:Knowledge and familiarity with hybrid bonging techniques and equipmentBachelor’s degree in Engineering or a related technical discipline.Minimum of 5 years of engineering experience in Fab Equipment managementMinimum of 3 years in experience in wafer bonding and de-bonding equipmentExperience in the semiconductor environment or in high volume advanced manufacturingDesire to take on technical challenges and shifting priorities in a fast paced cutting edge environmentAble to work with others in a team-oriented cultureExperience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand formatExperience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining.Ability to rapidly come up to speed with new computer applications and systemsAble to work for several hours per day in a clean room environmentDesired Knowledge/Skills but not required:Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensorsVBA, Python, R, SQL, or other basic programingThe current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.Total RewardsAt Samsung SAS, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.We offer a comprehensive benefits package, including:Medical, dental, and vision insuranceLife insurance and 401(k) matching with immediate vestingOnsite café(s) and workout facilitiesPaid maternity and paternity leavePaid time off (PTO) + 2 personal holidays and 10 regular holidaysWellness incentives and MORE Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.All positions at SAS are full-time on-site.U.S. Export Control ComplianceThis role requires access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.Trade Secrets Notice By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.* Please visit Samsung membership to see Privacy Policy, which defaults according to your location. You can change Country/Language at the bottom of the page. If you are European Economic Resident, please click here.* Samsung Electronics America, Inc. and its subsidiaries are committed to employing a diverse workforce, and provide Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.