Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Job Responsibilities:

• Perform moderately complex development activities, including the design, implementation, maintenance, testing, and documentation of software modules and subsystems for multiphysics and 3DSTACK analysis (e.g., LVS/DRC, thermal, mechanical stress).
• Develop scalable and custom solutions, streamline and automate workflows, and deploy robust production code using Python, Tcl/Tk, Bash, and other scripting languages.
• Strong problem-solving skills to identify complex design, tool, or flow issues related to multiphysics and 3D-IC, and facilitate their resolution.
• Improve design flows and methodologies for advanced technology nodes, specifically in the context of 3D-IC and multiphysics analysis.
• Support integration and enhancement of flows related to 3DBlox, 3DStack, and comprehensive multiphysic's simulation (thermal, mechanical, electrical, LVS/DRC) for 3D-IC.
• Collaborate with CAD, 3D/2.5D packaging, and physical implementation teams to address workflow requirements for sophisticated analysis.
• Supply to the development and integration of 3DBlox and standards-based solutions relevant to 3D-IC/3DStack architectures.
• Manage design data and EDA infrastructure, including tool installation/maintenance, server environment setup (Linux/Windows), resource monitoring, and solving, with a focus on multiphysics and 3D-IC tools.

Qualifications:

• Bachelor's degree with 4+ OR Master’s degree with 2+ years of experience in Computer Science, Computer Engineering, Electrical Engineering, or a closely related technical field.
• Solid understanding of software development and coding in C++/Python, Tcl/Tk, and Shell/Bash.
• Strong understanding and extensive usage of software data structures and software development in Windows and Linux environments.
• Prior experience with Flow Managers/MakeFiles for building complex design structures and workflows, particularly for multiphysics and 3D-IC analysis.
• Proficiency in design data management and EDA infrastructure, including organizing large-scale design data, installing/upgrading EDA tools, and managing server environments.
• Understanding of ASIC design methodology from RTL Synthesis to Physical Implementation phases, with Netlist-to-GDS flow expertise.
• Familiarity with version control systems (e.g., Git) and software development methodologies (e.g., Agile, Scrum).
• Familiarity with 2.5D and 3D solutions (e.g., TSMC InFO, CoWoS, GF GF32, ASE FoCUS, Amkor SWIFT, Samsung MDI), especially concerning their multiphysics implications.
• Ability to work independently and collaboratively within a team with minimal supervision.
• Advanced English speaking and writing skills for effective distributed team communication.

Preferred Skills & Experience:

• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions.
• Familiarity with Package Design tools (e.g., Cadence APD/SiP, Siemens Xpedition).
• Direct experience with Multiphysics Tools (e.g., Siemens FloTHERM/IcePack, Simcenter 3D, Ansys Mechanical, Ansys Icepak) for thermal, mechanical stress, or electrical analysis.
• Direct exposure to developing, integrating, or supporting 3DBlox and 3DStack technologies, and related industry standards.
• Strong background in multiphysics simulation and fixing workflow/tool-related issues in 3D-IC/SiP environments, including thermal, mechanical warpage, and electrical parasitics.

We are Siemens:

A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!

We offer a comprehensive reward package which includes a competitive basic salary, bonus scheme, generous holiday allowance, pension, and private healthcare.

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