ASIC Package Engineer

Location: Eindhoven, United States | Paris, France

Department: Spectacles

Employment Type: Full time

About Snap Inc

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.

About the Role

Snap Inc is a camera company that believes AR technology will transform how people connect in the real world. Our Spectacles team is pioneering fifth-generation standalone AR glasses powered by Snap OS, blending advanced cameras, sensors, and custom silicon to enable immersive play, learning, and collaboration. Join our Wearable Computing Silicon group as an ASIC Package Engineer and drive the packaging innovations that power these boundary-pushing devices, ensuring seamless integration of high-performance silicon into ultra-compact, all-day wearable form factors. In this role, you’ll lead the end-to-end package design for next-gen Spectacles silicon, from conceptualizing advanced solutions like FC-CSPs, SiPs, and 3D-stacked modules to managing production with global partners. Embedded in a cross-functional team building full consumer products, you’ll collaborate on silicon floorplans, bump maps, TSVs, and system-level integration—bridging ASIC development with PCB design to optimize signal integrity, power delivery, and thermals for AR camera systems. You’ll prototype substrates and interposers, qualify packages per industry standards with our NPI team, and proactively resolve manufacturing challenges to deliver high-yield, reliable hardware. We’re seeking a seasoned engineer with 7+ years in ASIC packaging, deep PI/SI expertise, and a track record of shipping volume products. Thrive in Snap’s creative, diverse culture where your innovations directly enhance AR experiences on Snapchat and Spectacles. With our 'Default Together' policy (4+ days/week in-office), you’ll collaborate dynamically to accelerate human progress through camera-first AR tech. Snap is an equal opportunity employer committed to diversity—apply your passion for Snapchat and creativity to shape the future of wearables!

What You'll Do

• Lead Snap’s packaging efforts for custom silicon in next-generation Spectacles AR glasses from concept to high-volume production
• Design advanced packages including FCCSPs, SiP, 3D-stacked modules, ball maps, substrates, and interposers tailored for wearable AR hardware
• Collaborate with silicon design teams on floorplans, bump maps, TSVs, and system integration for camera-driven AR experiences
• Bridge custom ASIC development with PCB integration, ensuring signal integrity, power delivery, and thermal performance for compact Spectacles form factors
• Define, prototype, and validate packaging solutions to achieve high yield and manufacturability in AR wearables
• Select and manage third-party packaging partners in collaboration with Snap’s Global Supply team
• Work with NPI team to develop qualification plans per industry standards and mitigate risks in product introduction
• Analyze production issues, implement process improvements, and drive contingency plans for reliable AR glasses manufacturing
• Contribute to silicon floorplanning and simulations to support Snap OS-powered standalone AR capabilities
• Foster innovation in packaging to enable seamless real-world AR interactions through Spectacles
• Document processes and support team growth in Snap’s diverse Wearable Computing Silicon group

Minimum Qualifications

• BSc or MSc degree in electrical engineering or related field, or equivalent practical experience
• 7+ years of experience in ASIC package development
• 3+ years of experience in Power Integrity and Signal Integrity analysis
• Excellent project management skills with proven track record in leading package designs from concept to production
• Hands-on experience designing complex packages including FC-CSP, SiP, and 3D-stacked solutions
• Deep knowledge of packaging assembly processes, thermal simulations, and manufacturability
• Strong English communication skills, both written and verbal
• Experience collaborating with cross-functional teams including design, engineering, and manufacturing

Preferred Qualifications

• Familiarity with semiconductor supply chain and logistics management
• Experience with failure analysis techniques and troubleshooting packaging yield issues
• Hands-on experience with requirement management and software tools like GitHub
• Mandarin language skills
• Passion for Snapchat, AR innovation, and camera technology
• Experience in wearable devices or consumer electronics packaging

Knowledge, Skills & Abilities

• Expertise in designing complex ASIC packages (FC-CSP, SiP, 3D-stacking)
• Proficiency with packaging design tools and simulation software
• Deep understanding of signal integrity and power integrity principles
• Experience driving PI/SI simulations and interpreting results
• Knowledge of package thermal analysis and management
• Familiarity with TSVs, bump maps, substrates, and interposers
• Strong process development and documentation skills
• Proven manufacturability and yield optimization experience
• Excellent problem-solving and risk mitigation abilities
• Proactive, flexible team player with can-do attitude
• Superior project management and partner coordination
• Cross-functional collaboration in fast-paced environments
• Understanding of semiconductor assembly steps
• Analytical skills for production issue resolution
• Passion for AR innovation and wearable camera tech
• Effective verbal and written communication

Our Benefits

• Paid parental leave to support work-life balance
• Comprehensive medical, dental, and vision coverage
• Emotional and mental health support programs
• Competitive compensation packages with equity to share in Snap’s success
• Flexible PTO and wellness initiatives
• Onsite perks including meals, fitness facilities, and creative collaboration spaces
• Professional development opportunities in AR and camera technology
• Inclusive culture with accommodations for disabilities
• 4+ days/week in-office under our 'Default Together' policy to build Snap’s innovative culture

"Default Together" Policy: At Snap Inc, we practice a "default together" approach and expect team members to work in an office 4+ days per week.

Snap is proud to be an equal opportunity employer.