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Snap Inc logo

PCB Design Engineer, Level 5

Snap Inc

PCB Design Engineer, Level 5

Snap Inc logo

Snap Inc

full-time

Posted: December 3, 2025

Number of Vacancies: 1

Job Description

PCB Design Engineer, Level 5

Location: Boulder, United States | Los Angeles, Canada | Palo Alto, Canada

Department: Spectacles

Employment Type: Full time

About Snap Inc

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.

About the Role

Snap Inc is a camera company believing that the camera + AI will help people share themselves more authentically. We’re looking for a PCB Design Engineer, Level 5 to join our Spectacles team, home to our world-class hardware R&D pushing the boundaries of augmented reality glasses. In this role, you’ll craft cutting-edge PCBs that power Next Generation Spectacles, overlaying computing on the real world to enable immersive AR experiences. Collaborating with electrical, mechanical, and manufacturing engineers, you’ll design high-density flexes and rigid-flexes from prototype to mass production using Allegro, ensuring our AR innovations delight millions on Snapchat. You’ll tackle complex challenges like stacked microvias, fine-pitch BGAs, and impedance-controlled high-speed nets for camera systems, while creating fabrication drawings, enforcing design rules, and verifying outputs. Partnering with suppliers and managing ECAD resources, you’ll solve engineering hurdles to hit aggressive deadlines in our creative, fast-paced culture. Your work will directly contribute to Snap’s mission of empowering authentic expression through AR hardware that redefines how people live, learn, and connect. At Snap, our 'Default Together' policy fosters dynamic collaboration with 4+ days in-office weekly. We celebrate diverse backgrounds, offering equal opportunity employment and accommodations as needed. Join a team where innovation meets creativity to build the future of AR eyewear.

What You'll Do

  • Work closely with electrical, mechanical, and manufacturing engineers to produce industry-leading flexes and PCB designs for Spectacles AR glasses from prototype through mass production
  • Design high-density PCBs, flexes, and rigid-flexes using stacked microvias, sequential lamination stack-ups, and fine pitch packages optimized for AR camera systems
  • Create detailed fabrication and assembly drawings, define design rules, and apply them via constraint manager
  • Design within strict limits, generate artworks, and produce comprehensive fabrication and assembly documentation
  • Verify designs prior to release and review Gerber/ODB++ data to ensure highest quality for AR innovation
  • Collaborate with suppliers on advanced stackups, capabilities, and resolution of complex engineering issues
  • Manage external ECAD resources to support rapid iteration in Snap's fast-paced hardware development
  • Drive simultaneous development of multiple challenging PCB designs to meet critical program deadlines for next-gen Spectacles
  • Apply DFM, DFA, and DFT principles to ensure manufacturability of high-performance AR hardware
  • Integrate PCBs for camera technology, ensuring signal integrity for analog, RF, high-speed, and power circuits
  • Contribute to pushing boundaries of AR by overlaying computing on the real world through precise PCB layouts

Minimum Qualifications

  • 7+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs
  • Master’s degree in a technical field + 6+ years of post-grad experience, or PhD in a relevant technical field + 3+ years of post-grad experience
  • Experience designing PCBs from prototype through mass production
  • Proficiency in Allegro PCB Designer for flexes and rigid-flex designs
  • Ability to create fabrication and assembly drawings and verify designs prior to release
  • Experience collaborating with suppliers on stackups, capabilities, and engineering issues
  • Demonstrated ability to manage external ECAD resources and review Gerber/ODB++ data for quality
  • Capacity to drive simultaneous development of multiple complex PCB designs to meet critical deadlines

Preferred Qualifications

  • Experience developing consumer electronic devices at production scale, especially AR hardware like smart glasses
  • Strong skills in routing impedance controlled nets, including differential pairs for high-speed signals in camera and AR systems
  • Knowledge of PCB design standards for interfaces like USB, PCIE, CSI, MIPI, and WIFI in consumer products
  • Expertise in Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets
  • Experience with PCB ECAD Library creation, management, and script/automation
  • Understanding of system integration best practices including board mating, high-speed length matching, and mechanical checks

Knowledge, Skills & Abilities

  • Expertise in Allegro PCB Designer for high-density HDI boards
  • Proficiency in designing flex and rigid-flex PCBs with microvias
  • Strong signal integrity skills for impedance-controlled nets and differential pairs
  • Knowledge of IPC standards, DFM, DFA, and DFT
  • Experience with fine pitch BGA placement (<0.5mm)
  • Skilled in Gerber/ODB++ review and design verification
  • Ability to create and manage PCB libraries and automation scripts
  • Understanding of high-speed interfaces (USB, PCIE, CSI, MIPI, WIFI)
  • Effective communication in oral and written forms
  • Logical reasoning to evaluate problem-solving approaches
  • Attention to detail and accuracy in complex designs
  • Ability to work under pressure and meet tight deadlines
  • Strong organization and prioritization in multi-project environments
  • Collaboration in fast-paced, cross-functional teams with vendors and suppliers

Our Benefits

  • Paid parental leave to support work-life balance
  • Comprehensive medical, dental, and vision coverage
  • Emotional and mental health support programs
  • Competitive compensation packages with equity in the form of RSUs
  • 401(k) matching and financial wellness resources
  • Flexible paid time off and wellness stipends
  • On-site perks including meals, fitness facilities, and collaborative spaces
  • Professional development opportunities in AR and hardware innovation
  • Inclusive culture with employee resource groups and diversity initiatives

Compensation

$190,000-$284,000 annually

This position is eligible for equity in the form of RSUs.

"Default Together" Policy: At Snap Inc, we practice a "default together" approach and expect team members to work in an office 4+ days per week.

Snap is proud to be an equal opportunity employer.

Locations

  • Boulder, United States
  • Los Angeles, Canada
  • Palo Alto, Canada

Salary

190,000 - 284,000 USD / yearly

Skills Required

  • Expertise in Allegro PCB Designer for high-density HDI boardsintermediate
  • Proficiency in designing flex and rigid-flex PCBs with microviasintermediate
  • Strong signal integrity skills for impedance-controlled nets and differential pairsintermediate
  • Knowledge of IPC standards, DFM, DFA, and DFTintermediate
  • Experience with fine pitch BGA placement (<0.5mm)intermediate
  • Skilled in Gerber/ODB++ review and design verificationintermediate
  • Ability to create and manage PCB libraries and automation scriptsintermediate
  • Understanding of high-speed interfaces (USB, PCIE, CSI, MIPI, WIFI)intermediate
  • Effective communication in oral and written formsintermediate
  • Logical reasoning to evaluate problem-solving approachesintermediate
  • Attention to detail and accuracy in complex designsintermediate
  • Ability to work under pressure and meet tight deadlinesintermediate
  • Strong organization and prioritization in multi-project environmentsintermediate
  • Collaboration in fast-paced, cross-functional teams with vendors and suppliersintermediate

Required Qualifications

  • 7+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs (experience)
  • Master’s degree in a technical field + 6+ years of post-grad experience, or PhD in a relevant technical field + 3+ years of post-grad experience (experience)
  • Experience designing PCBs from prototype through mass production (experience)
  • Proficiency in Allegro PCB Designer for flexes and rigid-flex designs (experience)
  • Ability to create fabrication and assembly drawings and verify designs prior to release (experience)
  • Experience collaborating with suppliers on stackups, capabilities, and engineering issues (experience)
  • Demonstrated ability to manage external ECAD resources and review Gerber/ODB++ data for quality (experience)
  • Capacity to drive simultaneous development of multiple complex PCB designs to meet critical deadlines (experience)

Preferred Qualifications

  • Experience developing consumer electronic devices at production scale, especially AR hardware like smart glasses (experience)
  • Strong skills in routing impedance controlled nets, including differential pairs for high-speed signals in camera and AR systems (experience)
  • Knowledge of PCB design standards for interfaces like USB, PCIE, CSI, MIPI, and WIFI in consumer products (experience)
  • Expertise in Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets (experience)
  • Experience with PCB ECAD Library creation, management, and script/automation (experience)
  • Understanding of system integration best practices including board mating, high-speed length matching, and mechanical checks (experience)

Responsibilities

  • Work closely with electrical, mechanical, and manufacturing engineers to produce industry-leading flexes and PCB designs for Spectacles AR glasses from prototype through mass production
  • Design high-density PCBs, flexes, and rigid-flexes using stacked microvias, sequential lamination stack-ups, and fine pitch packages optimized for AR camera systems
  • Create detailed fabrication and assembly drawings, define design rules, and apply them via constraint manager
  • Design within strict limits, generate artworks, and produce comprehensive fabrication and assembly documentation
  • Verify designs prior to release and review Gerber/ODB++ data to ensure highest quality for AR innovation
  • Collaborate with suppliers on advanced stackups, capabilities, and resolution of complex engineering issues
  • Manage external ECAD resources to support rapid iteration in Snap's fast-paced hardware development
  • Drive simultaneous development of multiple challenging PCB designs to meet critical program deadlines for next-gen Spectacles
  • Apply DFM, DFA, and DFT principles to ensure manufacturability of high-performance AR hardware
  • Integrate PCBs for camera technology, ensuring signal integrity for analog, RF, high-speed, and power circuits
  • Contribute to pushing boundaries of AR by overlaying computing on the real world through precise PCB layouts

Benefits

  • general: Paid parental leave to support work-life balance
  • general: Comprehensive medical, dental, and vision coverage
  • general: Emotional and mental health support programs
  • general: Competitive compensation packages with equity in the form of RSUs
  • general: 401(k) matching and financial wellness resources
  • general: Flexible paid time off and wellness stipends
  • general: On-site perks including meals, fitness facilities, and collaborative spaces
  • general: Professional development opportunities in AR and hardware innovation
  • general: Inclusive culture with employee resource groups and diversity initiatives

Target Your Resume for "PCB Design Engineer, Level 5" , Snap Inc

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Tags & Categories

Snap IncSnapchatSocial MediaARSpectaclesBoulderUnited StatesSpectacles

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Snap Inc logo

PCB Design Engineer, Level 5

Snap Inc

PCB Design Engineer, Level 5

Snap Inc logo

Snap Inc

full-time

Posted: December 3, 2025

Number of Vacancies: 1

Job Description

PCB Design Engineer, Level 5

Location: Boulder, United States | Los Angeles, Canada | Palo Alto, Canada

Department: Spectacles

Employment Type: Full time

About Snap Inc

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.

About the Role

Snap Inc is a camera company believing that the camera + AI will help people share themselves more authentically. We’re looking for a PCB Design Engineer, Level 5 to join our Spectacles team, home to our world-class hardware R&D pushing the boundaries of augmented reality glasses. In this role, you’ll craft cutting-edge PCBs that power Next Generation Spectacles, overlaying computing on the real world to enable immersive AR experiences. Collaborating with electrical, mechanical, and manufacturing engineers, you’ll design high-density flexes and rigid-flexes from prototype to mass production using Allegro, ensuring our AR innovations delight millions on Snapchat. You’ll tackle complex challenges like stacked microvias, fine-pitch BGAs, and impedance-controlled high-speed nets for camera systems, while creating fabrication drawings, enforcing design rules, and verifying outputs. Partnering with suppliers and managing ECAD resources, you’ll solve engineering hurdles to hit aggressive deadlines in our creative, fast-paced culture. Your work will directly contribute to Snap’s mission of empowering authentic expression through AR hardware that redefines how people live, learn, and connect. At Snap, our 'Default Together' policy fosters dynamic collaboration with 4+ days in-office weekly. We celebrate diverse backgrounds, offering equal opportunity employment and accommodations as needed. Join a team where innovation meets creativity to build the future of AR eyewear.

What You'll Do

  • Work closely with electrical, mechanical, and manufacturing engineers to produce industry-leading flexes and PCB designs for Spectacles AR glasses from prototype through mass production
  • Design high-density PCBs, flexes, and rigid-flexes using stacked microvias, sequential lamination stack-ups, and fine pitch packages optimized for AR camera systems
  • Create detailed fabrication and assembly drawings, define design rules, and apply them via constraint manager
  • Design within strict limits, generate artworks, and produce comprehensive fabrication and assembly documentation
  • Verify designs prior to release and review Gerber/ODB++ data to ensure highest quality for AR innovation
  • Collaborate with suppliers on advanced stackups, capabilities, and resolution of complex engineering issues
  • Manage external ECAD resources to support rapid iteration in Snap's fast-paced hardware development
  • Drive simultaneous development of multiple challenging PCB designs to meet critical program deadlines for next-gen Spectacles
  • Apply DFM, DFA, and DFT principles to ensure manufacturability of high-performance AR hardware
  • Integrate PCBs for camera technology, ensuring signal integrity for analog, RF, high-speed, and power circuits
  • Contribute to pushing boundaries of AR by overlaying computing on the real world through precise PCB layouts

Minimum Qualifications

  • 7+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs
  • Master’s degree in a technical field + 6+ years of post-grad experience, or PhD in a relevant technical field + 3+ years of post-grad experience
  • Experience designing PCBs from prototype through mass production
  • Proficiency in Allegro PCB Designer for flexes and rigid-flex designs
  • Ability to create fabrication and assembly drawings and verify designs prior to release
  • Experience collaborating with suppliers on stackups, capabilities, and engineering issues
  • Demonstrated ability to manage external ECAD resources and review Gerber/ODB++ data for quality
  • Capacity to drive simultaneous development of multiple complex PCB designs to meet critical deadlines

Preferred Qualifications

  • Experience developing consumer electronic devices at production scale, especially AR hardware like smart glasses
  • Strong skills in routing impedance controlled nets, including differential pairs for high-speed signals in camera and AR systems
  • Knowledge of PCB design standards for interfaces like USB, PCIE, CSI, MIPI, and WIFI in consumer products
  • Expertise in Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets
  • Experience with PCB ECAD Library creation, management, and script/automation
  • Understanding of system integration best practices including board mating, high-speed length matching, and mechanical checks

Knowledge, Skills & Abilities

  • Expertise in Allegro PCB Designer for high-density HDI boards
  • Proficiency in designing flex and rigid-flex PCBs with microvias
  • Strong signal integrity skills for impedance-controlled nets and differential pairs
  • Knowledge of IPC standards, DFM, DFA, and DFT
  • Experience with fine pitch BGA placement (<0.5mm)
  • Skilled in Gerber/ODB++ review and design verification
  • Ability to create and manage PCB libraries and automation scripts
  • Understanding of high-speed interfaces (USB, PCIE, CSI, MIPI, WIFI)
  • Effective communication in oral and written forms
  • Logical reasoning to evaluate problem-solving approaches
  • Attention to detail and accuracy in complex designs
  • Ability to work under pressure and meet tight deadlines
  • Strong organization and prioritization in multi-project environments
  • Collaboration in fast-paced, cross-functional teams with vendors and suppliers

Our Benefits

  • Paid parental leave to support work-life balance
  • Comprehensive medical, dental, and vision coverage
  • Emotional and mental health support programs
  • Competitive compensation packages with equity in the form of RSUs
  • 401(k) matching and financial wellness resources
  • Flexible paid time off and wellness stipends
  • On-site perks including meals, fitness facilities, and collaborative spaces
  • Professional development opportunities in AR and hardware innovation
  • Inclusive culture with employee resource groups and diversity initiatives

Compensation

$190,000-$284,000 annually

This position is eligible for equity in the form of RSUs.

"Default Together" Policy: At Snap Inc, we practice a "default together" approach and expect team members to work in an office 4+ days per week.

Snap is proud to be an equal opportunity employer.

Locations

  • Boulder, United States
  • Los Angeles, Canada
  • Palo Alto, Canada

Salary

190,000 - 284,000 USD / yearly

Skills Required

  • Expertise in Allegro PCB Designer for high-density HDI boardsintermediate
  • Proficiency in designing flex and rigid-flex PCBs with microviasintermediate
  • Strong signal integrity skills for impedance-controlled nets and differential pairsintermediate
  • Knowledge of IPC standards, DFM, DFA, and DFTintermediate
  • Experience with fine pitch BGA placement (<0.5mm)intermediate
  • Skilled in Gerber/ODB++ review and design verificationintermediate
  • Ability to create and manage PCB libraries and automation scriptsintermediate
  • Understanding of high-speed interfaces (USB, PCIE, CSI, MIPI, WIFI)intermediate
  • Effective communication in oral and written formsintermediate
  • Logical reasoning to evaluate problem-solving approachesintermediate
  • Attention to detail and accuracy in complex designsintermediate
  • Ability to work under pressure and meet tight deadlinesintermediate
  • Strong organization and prioritization in multi-project environmentsintermediate
  • Collaboration in fast-paced, cross-functional teams with vendors and suppliersintermediate

Required Qualifications

  • 7+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs (experience)
  • Master’s degree in a technical field + 6+ years of post-grad experience, or PhD in a relevant technical field + 3+ years of post-grad experience (experience)
  • Experience designing PCBs from prototype through mass production (experience)
  • Proficiency in Allegro PCB Designer for flexes and rigid-flex designs (experience)
  • Ability to create fabrication and assembly drawings and verify designs prior to release (experience)
  • Experience collaborating with suppliers on stackups, capabilities, and engineering issues (experience)
  • Demonstrated ability to manage external ECAD resources and review Gerber/ODB++ data for quality (experience)
  • Capacity to drive simultaneous development of multiple complex PCB designs to meet critical deadlines (experience)

Preferred Qualifications

  • Experience developing consumer electronic devices at production scale, especially AR hardware like smart glasses (experience)
  • Strong skills in routing impedance controlled nets, including differential pairs for high-speed signals in camera and AR systems (experience)
  • Knowledge of PCB design standards for interfaces like USB, PCIE, CSI, MIPI, and WIFI in consumer products (experience)
  • Expertise in Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets (experience)
  • Experience with PCB ECAD Library creation, management, and script/automation (experience)
  • Understanding of system integration best practices including board mating, high-speed length matching, and mechanical checks (experience)

Responsibilities

  • Work closely with electrical, mechanical, and manufacturing engineers to produce industry-leading flexes and PCB designs for Spectacles AR glasses from prototype through mass production
  • Design high-density PCBs, flexes, and rigid-flexes using stacked microvias, sequential lamination stack-ups, and fine pitch packages optimized for AR camera systems
  • Create detailed fabrication and assembly drawings, define design rules, and apply them via constraint manager
  • Design within strict limits, generate artworks, and produce comprehensive fabrication and assembly documentation
  • Verify designs prior to release and review Gerber/ODB++ data to ensure highest quality for AR innovation
  • Collaborate with suppliers on advanced stackups, capabilities, and resolution of complex engineering issues
  • Manage external ECAD resources to support rapid iteration in Snap's fast-paced hardware development
  • Drive simultaneous development of multiple challenging PCB designs to meet critical program deadlines for next-gen Spectacles
  • Apply DFM, DFA, and DFT principles to ensure manufacturability of high-performance AR hardware
  • Integrate PCBs for camera technology, ensuring signal integrity for analog, RF, high-speed, and power circuits
  • Contribute to pushing boundaries of AR by overlaying computing on the real world through precise PCB layouts

Benefits

  • general: Paid parental leave to support work-life balance
  • general: Comprehensive medical, dental, and vision coverage
  • general: Emotional and mental health support programs
  • general: Competitive compensation packages with equity in the form of RSUs
  • general: 401(k) matching and financial wellness resources
  • general: Flexible paid time off and wellness stipends
  • general: On-site perks including meals, fitness facilities, and collaborative spaces
  • general: Professional development opportunities in AR and hardware innovation
  • general: Inclusive culture with employee resource groups and diversity initiatives

Target Your Resume for "PCB Design Engineer, Level 5" , Snap Inc

Get personalized recommendations to optimize your resume specifically for PCB Design Engineer, Level 5. Takes only 15 seconds!

AI-powered keyword optimization
Skills matching & gap analysis
Experience alignment suggestions

Check Your ATS Score for "PCB Design Engineer, Level 5" , Snap Inc

Find out how well your resume matches this job's requirements. Get comprehensive analysis including ATS compatibility, keyword matching, skill gaps, and personalized recommendations.

ATS compatibility check
Keyword optimization analysis
Skill matching & gap identification
Format & readability score

Tags & Categories

Snap IncSnapchatSocial MediaARSpectaclesBoulderUnited StatesSpectacles

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No related jobs found at the moment.