PCB Design Engineer, Level 6

Location: Boulder, United States | Palo Alto, Canada | Santa Monica, United States

Department: Spectacles

Employment Type: Full time

About Snap Inc

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.

About the Role

Snap Inc. is a technology company that believes the camera presents the greatest opportunity to improve the way people live and communicate. We empower people to express themselves, live in the moment, learn about the world, and have fun together through Snapchat, Lens Studio, and our AR glasses, Spectacles. Spectacles is home to our world-class hardware R&D team, pushing the boundaries of camera technology by overlaying computing on the real world. Next Generation Spectacles bring augmented reality to life in wearable form. Join our SnapLab Hardware team as a PCB Design Engineer, Level 6, and contribute to innovative AR eyewear that redefines human connection. In this role, you’ll collaborate closely with electrical, mechanical, and manufacturing engineers to craft industry-leading flexes and high-density PCBs—from prototypes to mass production—using Allegro PCB Designer. You’ll tackle complex designs featuring stacked microvias, sequential lamination, and fine-pitch packages optimized for compact AR camera systems. Responsibilities include defining design rules, generating fabrication documentation, verifying designs, and partnering with suppliers to solve challenges, all while driving multiple projects to meet aggressive deadlines in our creative, fast-paced culture. We seek a seasoned engineer with 10+ years of experience (or equivalent advanced degree) in high-density HDI PCB layout for consumer electronics. Thrive in Snap’s innovative environment by applying skills in impedance-controlled routing, RF/high-speed design, and standards like IPC and DFM. Preferred expertise in consumer-scale AR hardware, Flex/Rigid-Flex, and tools like Cadence Allegro will set you apart. Our ‘Default Together’ policy fosters dynamic collaboration with 4+ days in-office weekly. Snap Inc. celebrates diverse backgrounds and voices to fuel AR innovation. We’re an equal opportunity employer offering competitive pay (Zone A: $276,000-$414,000 base; plus RSUs), comprehensive benefits like paid parental leave, medical coverage, mental health support, and more. If you’re passionate about camera tech and AR, apply to shape the future at Snap!

What You'll Do

• Work closely with electrical, mechanical, and manufacturing engineers to produce industry-leading flexes and PCB designs for Next Generation Spectacles from prototype through mass production
• Design high-density PCBs, flexes, and rigid-flexes using stacked microvias, sequential lamination stack-ups, and fine pitch packages tailored to AR camera systems
• Create detailed fabrication and assembly drawings for Snap's innovative AR hardware
• Define and apply design rules to the constraint manager, ensuring designs stay within limits for camera and computing overlays
• Generate artworks, fabrication, and assembly documentation while verifying designs prior to release
• Collaborate with suppliers to optimize stackups, assess capabilities, and resolve engineering challenges in AR glasses development
• Manage external ECAD resources to support rapid iteration in Snap's fast-paced Spectacles team
• Review Gerber/ODB++ data to ensure the highest quality of design releases for production-scale AR devices
• Drive simultaneous development of multiple challenging PCB designs to meet critical program deadlines for pushing AR boundaries
• Apply best practices for system integration, including high-speed length matching and mechanical interference checks for multi-board AR assemblies
• Innovate PCB layouts for analog, RF, high-speed, and power circuits in compact Spectacles form factors

Minimum Qualifications

• 10+ years of post-Bachelor’s in Electrical Engineering experience in PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs
• Master’s degree in a technical field + 9+ years of post-grad experience, or PhD in a relevant technical field + 6+ years of post-grad experience
• Experience designing PCBs from prototype through mass production
• Proficiency in Allegro PCB Designer for flexes and rigid-flex designs
• Ability to create fabrication and assembly drawings and verify designs prior to release
• Experience collaborating with suppliers on stackups, capabilities, and engineering issues
• Demonstrated ability to manage external ECAD resources and review Gerber/ODB++ data for quality
• Capacity to drive simultaneous development of multiple complex PCB designs to meet critical deadlines

Preferred Qualifications

• Experience developing consumer electronic devices at production scale, especially AR hardware like Spectacles
• Strong skills in routing impedance controlled nets, including differential pairs for high-speed signals
• Knowledge of IPC standards, DFM, DFA, and DFT for high-density multi-layer designs
• Familiarity with PCB design standards for USB, PCIE, CSI, MIPI, and WIFI interfaces
• Experience with Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, Valor toolsets
• Background in PCB ECAD Library creation, management, and script/automation

Knowledge, Skills & Abilities

• Expertise in Allegro PCB Designer for high-density HDI boards
• Proficiency in designing flex and rigid-flex PCBs with microvias
• Strong routing skills for impedance-controlled nets and differential pairs
• Knowledge of high-speed design for analog, RF, and power circuits
• Experience with DFM, DFA, DFT, and IPC standards
• Familiarity with interfaces like USB, PCIE, CSI, MIPI, and WIFI
• Skilled in Gerber/ODB++ review and design verification
• Ability to create and manage PCB ECAD libraries
• Scripting and automation for PCB design processes
• Effective oral and written communication
• Logical reasoning to evaluate problem-solving approaches
• Attention to detail and accuracy in assignments
• Ability to work under pressure and meet tight deadlines
• Strong organization and prioritization for multiple deadlines
• Collaboration in fast-paced, cross-functional teams
• Vendor and supplier management
• System-level integration and layout verification

Our Benefits

• Paid parental leave to support work-life balance
• Comprehensive medical, dental, and vision coverage
• Emotional and mental health support programs
• Compensation packages including equity in the form of RSUs to share in Snap’s long-term success
• Generous paid time off and flexible working arrangements
• Professional development opportunities in AR and camera technology
• On-site perks including meals, wellness programs, and collaborative spaces
• 401(k) matching and financial planning resources
• Employee stock purchase plan

Compensation

$276,000-$414,000 annually

This position is eligible for equity in the form of RSUs.

"Default Together" Policy: At Snap Inc, we practice a "default together" approach and expect team members to work in an office 4+ days per week.

Snap is proud to be an equal opportunity employer.