芯片设计工程师
Tencent
芯片设计工程师
Job Description
芯片设计工程师
📋 Job Overview
The Chip Design Engineer position at Tencent involves designing and implementing SoC/IP systems and subsystems. Responsibilities include module architecture design, RTL implementation, timing analysis, PPA optimization, and supporting system integration. The role also entails collaboration with performance analysis and design verification teams for chip performance improvements and testing.
📍 Location: Shenzhen, China
🏢 Business Unit: TEG
📄 Full Description
2.负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化；
3.支撑 SoC/IP 的系统集成，以及文档编写；
4.与性能分析团队一起进行芯片性能改进；
5.与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试。
🎯 Key Responsibilities
- 参与SoC/IP 系统/子系统的设计和实现
- 负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化
- 支撑 SoC/IP 的系统集成，以及文档编写
- 与性能分析团队一起进行芯片性能改进
- 与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试
Locations
- Shenzhen, China
Salary
300,000 - 800,000 CNY / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Responsibilities
- 参与SoC/IP 系统/子系统的设计和实现
- 负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化
- 支撑 SoC/IP 的系统集成，以及文档编写
- 与性能分析团队一起进行芯片性能改进
- 与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试
Tags & Categories
Answer 10 quick questions to check your fit for 芯片设计工程师 @ Tencent.
Related Books and Jobs
芯片设计工程师
Tencent
芯片设计工程师
Job Description
芯片设计工程师
📋 Job Overview
The Chip Design Engineer position at Tencent involves designing and implementing SoC/IP systems and subsystems. Responsibilities include module architecture design, RTL implementation, timing analysis, PPA optimization, and supporting system integration. The role also entails collaboration with performance analysis and design verification teams for chip performance improvements and testing.
📍 Location: Shenzhen, China
🏢 Business Unit: TEG
📄 Full Description
2.负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化；
3.支撑 SoC/IP 的系统集成，以及文档编写；
4.与性能分析团队一起进行芯片性能改进；
5.与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试。
🎯 Key Responsibilities
- 参与SoC/IP 系统/子系统的设计和实现
- 负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化
- 支撑 SoC/IP 的系统集成，以及文档编写
- 与性能分析团队一起进行芯片性能改进
- 与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试
Locations
- Shenzhen, China
Salary
300,000 - 800,000 CNY / yearly
Source: ai estimated
* This is an estimated range based on market data and may vary based on experience and qualifications.
Responsibilities
- 参与SoC/IP 系统/子系统的设计和实现
- 负责模块架构设计、RTL实现、时序分析优化以及模块的PPA优化
- 支撑 SoC/IP 的系统集成，以及文档编写
- 与性能分析团队一起进行芯片性能改进
- 与设计验证团队一起制定验证测试计划，覆盖率分析，芯片仿真以及调试
Tags & Categories
Answer 10 quick questions to check your fit for 芯片设计工程师 @ Tencent.
Related Books and Jobs